參數(shù)資料
型號(hào): FOA1251B1
廠商: SIEMENS AG
英文描述: 2.5Gbit/s,3.3v transimpendence amplifier(2.5GBIT/S,3.3V 互阻抗放大器)
中文描述: 每秒2.5GB /秒,3.3 transimpendence放大器(每秒2.5GB /秒,3.3互阻抗放大器)
文件頁數(shù): 21/24頁
文件大小: 255K
代理商: FOA1251B1
FOA1251B1, FOA1252B1
Package and Bare Die Outlines
Advance Datasheet, Document Rev. 1.0
6-21
10June1999
Advance Information
6.2
Bare Die Outlines
Figure 6-1
Bond Pad Coordinates (top view).
Chip
Area:
Thickness:
Pad
Area:
Material:
1310 μm x 1000 μm
280 μm
100 μm x 100 μm
aluminium
130
280
405
530
125
250
375
500
625
750
875
905
655
780
1030
1180
1310
1000
0
0
137
1173
μm
μm
FOA1252B1
Pad Location
280
1030
μm
s
相關(guān)PDF資料
PDF描述
FOA1252B1 2.5Gbit/s,3.3v transimpendence amplifier(2.5GBIT/S,3.3V 互阻抗放大器)
foa1251b Transimpedance Amplifier TIA 2.5 Gbit/s, 3.3 V(互阻抗放大器)
foa1251 2.5 Gbit/s Transimpedance Amplifier(互阻抗放大器)
FOA1252A1 2.5 Gbit/s Transimpedance Amplifier(互阻抗放大器)
FOA1252A1 2.5 Gbit/s Transimpedance Amplifier
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