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參數(shù)資料
| 型號(hào)： | FMM5061VF |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | X-Band Power Amplifier MMIC |
| 中文描述： | X波段單片功率放大器 |
| 文件頁(yè)數(shù)： | 13/15頁(yè) |
| 文件大小： | 176K |
| 代理商： | FMM5061VF |
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Mounting Instructions for VF Package
13
X-Band Power Amplifier MMIC
FMM5061VF
1. Screw Mounting
(1) The flange of package may be attached using screws. Torque conditions are
shown in table 1.
Table 1. Recommended and Maximum Torque for Screw Mounting
Package
Recommended
screw
Recommended
Torque
Maximum Torque
VF
M2.0
10 N-cm (0.9 lb-in) 15 N-cm (1.3 lb-in)
(2) First, tighten the screws with a torque driver set to 5 N-cm.
(3) The surface finish of the heat sink should be better than 0.8
μ
m, and the
surface flatness must be better than 10
μ
m.
(4) Silicon based heat sink compounds should not be used for thermal
conductive grease. They cause poor grounding of the source flange,
contamination and long term degradation of thermal resistance between the
FET package and heat sink.
2. Solder Mounting
(1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder
(Sn-3.0Ag-0.5Cu)*
1
or equivalent.
(2) For
soldering,
Tin-Lead
solder
(Sn-3.0Ag-0.5Cu)*
1
shall be used. (*1: The figure displays with weight %. A
predominantly tin-rich alloy with 3.0% silver and 0.5% copper.)
(3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low
halogen content. After soldering, the flux residue should be removed by
appropriate cleaning methods.
(4) The recommended soldering conditions are as follows:
Partial heating method (soldering iron, spot laser/air)
Product terminal temperature: 260
deg-
C, max. 10 s./terminal
or 400
deg-
C, max. 3 s./terminal
(63Sn/37Pb)
or
Lead-Free
solder
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