參數(shù)資料
型號: FHX35X
廠商: FUJITSU LTD
元件分類: 小信號晶體管
英文描述: 12 AMP MINIATURE POWER RELAY
中文描述: KU BAND, GaAs, N-CHANNEL, RF SMALL SIGNAL, HEMFET
封裝: DIE-4
文件頁數(shù): 1/4頁
文件大?。?/td> 155K
代理商: FHX35X
Item
Conditions
Drain Current
Transconductance
Gate-Source Leakage Current
Gate-Drain Capacitance
Symbol
IDSS
IGSO
CGD
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25
°
C)
mA
nA
mS
pF
Unit
gm
Pinch-off Voltage
Vp
V
Gate-Source Capacitance
pF
CGS
Limits
Min.
85
20
-
Max.
15
-2.0
-0.2
45
-
-
FHX35X/002
FHX35LG/002
-
-
-
Min.
40
-1.0
60
0.27
-
-
0.47
10
0.035
Item
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Symbol
Tstg
VDS
6
-5
290
-65 to 175
mW
°
C
°
C
V
V
VGS
PT
Channel Temperature
+175
Tch
Rth
Thermal Resistance
150
Channel to Case
°
C/W
Ratings
Conditions
Unit
ABSOLUTE MAXIMUM RATINGS (Ambient Temperature Ta=25
°
C)
VGS=-2V
VDS=3V
IDS=10mA
VDS=3V, IDS=10mA
VDS=2V, VGS=0V
VDS=2V, IDS=10mA
VDS=2V, IDS=1mA
DESCRIPTION
The FHX35X/002 Chip and FHX35LG/002 packaged devices are HEMT
(High Electron Mobility Transistor) ones suitable for use as the front end
of an optical receiver in high speed lightwave communication systems.
This HEMT combines high transconductance, low gate capacitance and
low leakage current; all important factors in achieving low noise
preamplification. Fujitsu’s stringent Quality Assurance criteria and
detailed Test Procedures assure Highest Reliabiltity Performance.
FEATURES
High Transconductance
Low Leakage Current
Low Gate Capacitance
Gold Bonding System
Proven Reliability
1
Edition 1.1
May 1998
FHX35X/002
FHX35LG/002
Low Noise HEMT
LG PACKAGE
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