參數(shù)資料
型號(hào)： FHS900-717GG
廠商： ADVANCED INTERCONNECTIONS CORP
元件分類： 插座
英文描述： BGA900, IC SOCKET
文件頁數(shù)： 1/1頁
文件大小： 127K
代理商： FHS900-717GG
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 Fax 401-823-8723 Email info@advintcorp.com Internet http://www.advintcorp.com
Ball Grid Array
(BGA) Sockets
inch/(mm
)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 5
Features
:
Advanced exclusive eutectic solder ball
terminals offer superior SMT processing.
Uses same footprint as BGA device.
Proven long-term performance in vigorous
temperature cycling applications - solder
ball terminal absorbs TCE mismatch.
Closed bottom socket terminal for 100%
anti-wicking of solder.
Gold contacts allow gold/gold
interconnections to male Adapter pins.
Low insertion force socket with multi-
fingered high reliability Beryllium Copper
contacts.
Coplanarity consistently under .006 inch
industry standard.
In-house Tape and Reel packaging
available.
See page 4 for How It Works.
Terminals and Contacts:
Terminals:
Brass - Copper Alloy (C36000)
ASTM-B-16
Contacts:
Beryllium Copper - Copper
Alloy (C17200), ASTM-B-194
Plating:
G - Gold over Nickel
Body Material:
M - Molded High Temp. Glass Filled
Thermoplastic (P.P.S.), U.L. Rated 94V-O,
-60C to 260C (-76F to 500F)
F - FR-4 Glass Epoxy, U.L. Rated 94V-O
Solder:
63Sn/37Pb, Eutectic, 183C (361.4F)
Standard Socket (S):
Mates with Standard Adapter (A)
Socket size same size as BGA device body
Use with SMT Adapter for LGA and reworked
BGA device socketing
BGA Sockets
Terminals:
How To Order
Footprint Dash#
If Applicable
1
M
G
S
XXX -636
G
Contact Plating
G - Gold
Terminal Plating
G - Gold
Terminal Type
Body Type
M - Molded PPS (1.27 & 1.5mm pitch)
F - FR-4 (0.75, 0.80 & 1.0mm pitch)
Model Type
S = Standard Socket
SB = Extraction Slot (1.5, 1.27 and 1.0mm pitch only)
SG = Guide Post Socket (1.5 and 1.27mm pitch only)
Pitch
B = .059/(1.5mm)
G = .050/(1.27mm)
H = .039/(1.0mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
Number of Positions
See BGA Footprint section or web site
Extraction Socket (SB):
Mates with Extraction Slot Adapter (AX)
Socket size equals BGA body + .079/(2.0)
Protects valuable PCB during device/adapter
extraction - tool never touches PCB
Available in 1.0, 1.27 and 1.5mm pitch only
Guide Post Socket (SG):
Integral molded corners allow accurate positioning of
device/adapter assembly in blind-mating applications.
Mates with Extraction Slot Adapter (AX)
Socket size equals BGA body + .276/(7.00)
Available in 1.27 and 1.5mm pitch only
1.0mm Pitch Terminals
Type -716
Solder Ball
Type -717
Thru-Hole
.024/(0.61) Dia.
.105
(2.67)
.090
(2.29)
.015 Dia.
(0.38)
.105
(2.67)
.125
(3.18)
.090
(2.29)
PATENTED
Type -636
Solder Ball
Type -673
Thru-Hole
STANDARD
.018 Dia.
(0.46)
.117
(2.97)
.128
(3.25)
PATENTED
.030 Dia.
(0.76)
.117
(2.97)
.095
(2.41)
1.27 & 1.5mm Pitch Terminals
0.80mm Pitch Terminals
.011 Dia.
(0.28)
.125
(3.18)
.080
(2.03)
Type -731
Thru-Hole
Type -702
Solder Ball
.020/(0.51) Dia.
.125
(3.18)
PATENTED
0.75mm Pitch Terminals
Type -758
Solder Ball
.018/(0.46) Dia.
.125
(3.18)
PATENTED
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