參數(shù)資料
型號: FH25-33S-0.3SH
廠商: Hirose Electric USA, INC.
英文描述: 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.
中文描述: 聯(lián)系間距0.3毫米,0.9以上的電路板,柔性線路板中頻連接毫米。
文件頁數(shù): 8/8頁
文件大?。?/td> 482K
代理商: FH25-33S-0.3SH
8
B
FH25 Series FPC Construction (Recommended)
1. Using Single-sided FPC
Name
Covering film layer
Cover adhesive
Surface treatment
Copper foil
Base adhesive
Base film
Reinforcement material adhesive
Stiffener
Polyamide 1 mil thick.
1μm to 5μm nickel underplated
0.2μm gold plated
Cu
1oz
Polyamide 1 mil thick
Polyamide 3 mil thick
Total
25
25
(3)
35
25
25
30
75
193
Material
Thickness (μm)
2. Using Double-sided FPC
3. Precautions
Name
Covering film layer
Cover adhesive
Surface treatment
Through-hole copper
Copper foil
Base adhesive
Base film
Base adhesive
Copper foil
Cover adhesive
Covering layer film
Reinforcement material adhesive
Stiffener
Polyamide 1 mil thick
1μm to 5μm nickel underplated
0.2
μ
m gold plated
Cu
Cu
1/2oz
Polyamide 1 mil thick
Cu
1/2oz
Polyamide 1 mil thick
Polyamide 1 mil thick
Total
25
25
(3)
15
18
18
25
18
18
25
25
25
25
197
Material
Thickness (μm)
Note: Recommended specification for FPC 0.2 ± 0.03 mm thick.
To prevent release of the lock due to FPC bending, use of the FPC with copper foil on rear side is NOT RECOMMENDED.
Rear side
The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933
http://www.hirose.com
http://www.hirose-connectors.com
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