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參數(shù)資料
| 型號： | FCFBMJ3216HL160NT |
| 廠商： | TAIYO YUDEN CO LTD |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 1 FUNCTIONS, 2 A, FERRITE CHIP |
| 封裝： | EIA STD PACKAGE SIZE 1206 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 1133K |
| 代理商： | FCFBMJ3216HL160NT |
FERRITE
PRODUCTS
309
5
RELIABILITY DATA
*Note: K5 to J40C in taped packaging
Measuring equipment: Impedance analyzer (HP4291A) or its equivalent
Measuring frequency: 100M1 MHZ
Four-terminal method
Measuring equipment: Milliohm High-Tester 3226(Hioki Denki) or its equivalent
According to JIS C 0040.
Vibration type: A
Directions: 2 hrs each in X,Y, and Z directions
Total: 6 hrs
Frequency range: 10 to 55 to 10Hz(/min.)
Amplitude: 1.5 mm(shall not exceed acceleration 196m/s2)
Mounting method: Soldering onto PC board
Solder temperature: 230M5C
Duration: 4M1 sec.
Preconditioning: Immersion into flux.
Immersion and Removal speed: 25mm/sec.
Preheating: 150C for 3 min.
Solder temperature: 260M5C
Duration: 10M0.5sec
Preconditioning: Immersion into flux.
Immersion and Removal speed: 25 mm/sec.
Recovery: 2 to 3 hrs of recovery under the standard condition after the test.
According to JIS C 0025.
Conditions for 1 cycle
Step
Temperature(C)
Duration(min.)
1
K
40M3C
30M3
2
Room Temperature
Within 3
3
K
85M2C
30M3
4
Room Temperature
Within 3
Number of cycles: 100
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
from test chamber.
Temperature: 40M2C
Humidity: 90 to 95%RH
Duration: 500
hrs
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
from test chamber.
Temperature : 40M2C
Humidity : 90 to 95%RH
Applied current : Rated current
Duration : 500
hrs
Mounting method : Soldering onto PC board
Recovery : 2 to 3hrs of recovery under the standard condition after the removal
from test chamber.
Temperature: 85M2C
Duration: 500
hrs
Applied current: Rated current
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
from test chamber.
Warp: 2mm
Testing board: Glass epoxy-resin substrate
Thickness: 0.8mm
Applied force: 5N
Duration: 10 sec.
1/1
Item
Specified Value
Test Methods and Remarks
RECTANGULAR FERRITE CHIP BEADSfHIGH CURRENTgFB series M type
K
40 ~ J85C
K
40 ~ J85C
Within the specified tolerance
Within the specified range
Appearance: No significant abnormality
Impedance change: Within M30% of the initial value
75% or more of immersed surface of terminal electrode shall be covered with
fresh solder.
Appearance: No significant abnormality
Impedance change: Within M30% of the initial value
Appearance: No significant abnormality
Impedance change: Within
% of the initial value
Appearances: No significant abnormality
Impedance change: Within M30% of the initial value
Appearance : No significant abnormality
Impedance change : Within M30% of the initial value
Appearance: No significant abnormality
Impedance change: Within M30% of the initial value
No mechanical damage.
No separation or indication of separation of electrode.
Note on standard condition: "standard condition" referred to herein is defined as follows 5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity
and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
1.Operating Temperature Range
2.Storage Temperature Range
3.Impedance
4. DC Resistance
5.Rated Current
6.Vibration
7. Solderability
8.Resistance to Solder Heat
9.Thermal Shock
10.Humidity (steady state)
11.Loading under Damp Heat
12.High Temperature Loading
Test
13.Resistance to Flexure of
Substrate
14.Adhesion of Electrode
J
50
K
10
J
24
K
0
J
24
K
0
J
24
K
0
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