參數(shù)資料
型號: FB1L2Q
廠商: NEC Corp.
英文描述: COMPOUND TRANSISTOR
中文描述: 復(fù)合晶體管
文件頁數(shù): 6/8頁
文件大小: 111K
代理商: FB1L2Q
Data Sheet D16180EJ1V0DS
6
FB1 SERIES
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Surface MOUNTING TYPE
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 230
°
C, Time: 30 sec. max. (at 210
°
C or higher),
Count: Once, Exposure limit: None *
IR30-00
VPS
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or higher),
Count: Once, Exposure limit: None *
VP15-00
Partial heating
Pin temperature: 300
°
C max., Time: 10 sec. max. Exposure limit: None *
O
* After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Cautions 1. Do not use different soldering methods together (except for partial heating).
2. Prevent the resin surface temperature from being higher than the board temperature by 20
°
C or
more.
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