- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382953 > FB1 (NEC Corp.) COMPOUND TRANSISTOR PDF資料下載
參數(shù)資料
| 型號： | FB1 |
| 廠商： | NEC Corp. |
| 英文描述： | COMPOUND TRANSISTOR |
| 中文描述： | 復(fù)合晶體管 |
| 文件頁數(shù)： | 6/8頁 |
| 文件大小： | 111K |
| 代理商： | FB1 |
Data Sheet D16180EJ1V0DS
6
FB1 SERIES
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Surface MOUNTING TYPE
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 230
°
C, Time: 30 sec. max. (at 210
°
C or higher),
Count: Once, Exposure limit: None *
IR30-00
VPS
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or higher),
Count: Once, Exposure limit: None *
VP15-00
Partial heating
Pin temperature: 300
°
C max., Time: 10 sec. max. Exposure limit: None *
O
* After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Cautions 1. Do not use different soldering methods together (except for partial heating).
2. Prevent the resin surface temperature from being higher than the board temperature by 20
°
C or
more.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FB1A3M | COMPOUND TRANSISTOR |
| FB1A4A | COMPOUND TRANSISTOR |
| FB1A4M | COMPOUND TRANSISTOR |
| FB1A4M-T1B | COMPOUND TRANSISTOR |
| FB1F3P | COMPOUND TRANSISTOR |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FB-1 | 制造商:Panasonic Industrial Company 功能描述:FIBER BENDER (10PCS PER BOX) 制造商:Norgren 功能描述:Foot Bracket 制造商:Panasonic Electric Works 功能描述: |
| FB10 | 制造商:TE Connectivity / AMP 功能描述: |
| FB10.0 | 制造商:Schneider Electric 功能描述:THERMAL UNIT |
| FB10.6 | 制造商:Schneider Electric 功能描述:THERMAL UNIT |
| FB1000 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:10 Amp. Glass Passivated Bridge Rectifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。