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參數(shù)資料
| 型號： | FAN4174IP5X_NL |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 運(yùn)動控制電子 |
| 英文描述： | Single, Ultra-Low Cost, Rail-to-Rail I/O, CMOS Amplifier |
| 中文描述： | OP-AMP, 6000 uV OFFSET-MAX, 4 MHz BAND WIDTH, PDSO5 |
| 封裝： | LEAD FREE, SC-70, 5 PIN |
| 文件頁數(shù)： | 12/14頁 |
| 文件大?。?/td> | 511K |
| 代理商： | FAN4174IP5X_NL |
www.fairchildsemi.com
12
FAN4174/FAN4274 Rev. 2D
F
Mechanical Dimensions
b
e
e1
D
C
E
C
C
A
A2
A1
α
E1
C
2
D
C
NOTE:
1. All dimensions are in millimeters.
2 Foot length measured reference to flat
foot surface parallel to DATUM 'A' and lead surface.
3. Package outline exclusive of mold flash & metal burr.
4. Package outline inclusive of solder plating.
5. Comply to EIAJ SC74A.
6. Package ST 0003 REV A supercedes SOT-D-2005 REV C.
SYMBOL
A
A1
A2
b
C
D
E
E1
L
e
e1
α
MIN
0.90
0.00
0.90
0.25
0.09
2.80
2.60
1.50
0.35
0.95 ref
1.90 ref
0
MAX
1.45
0.15
1.30
0.50
0.20
3.10
3.00
1.75
0.55
10
SOT-23
SYMBOL
e 0.65 BSC
D
b
E
HE
Q1
A2
A1
A
c
L
MIN
MAX
1.80
0.15
1.15
1.80
0.10
0.80
0.00
0.80
0.10
1.10
2.20
0.30
1.35
2.40
0.40
1.00
0.10
1.10
0.18
0.30
b
e
D
C
HE
C
C
A
A2
A1
E
C
C
NOTE:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flashing and metal burr.
4. All speccifications comply to EIAJ SC70.
L
Q1
SC70
e
S
E/2
2X
E3
E4
1
2
ccc A B C
– B –
2
3
7
2
6
4
D2
A2
A
A1
– A –
–
bbb
A B C
M
D
3
b
4
aaa A
E1
– H –
t1
t2
Gauge
Plane
0.25mm
R1
R
L
L1
03
02
01
Detail A
Section A - A
b
c
c1
b1
E2
E1
E
Detail A
5
A
A
SYMBOL
A
A1
A2
D
D2
E
E1
E2
E3
E4
R
R1
t1
t2
b
b1
c
c1
01
02
03
L
L1
aaa
bbb
ccc
e
S
MIN
1.10
0.10
0.86
3.00
2.95
4.90
3.00
2.95
0.51
0.51
0.15
0.15
0.31
0.41
0.33
0.30
0.18
0.15
3.0
12.0
12.0
0.55
MAX
–
0.05
0.08
0.10
0.10
0.15
0.10
0.10
0.13
0.13
+0.15/-0.06
+0.15/-0.06
0.08
0.08
+0.07/-0.08
0.05
0.05
+0.03/-0.02
3.0
3.0
3.0
0.15
–
–
–
–
–
–
0.95 BSC
0.10
0.08
0.25
0.65 BSC
0.525 BSC
MSOP-8
NOTE:
1 All dimensions are in millimeters (angle in degrees), unless otherwise specified.
2
Datums – B – and – C – to be determined at datum plane – H – .
3
Dimensions "D" and "E1" are to be determined at datum – H – .
4
Dimensions "D2" and "E2" are for top package and dimensions "D" and "E1" are for bottom package.
5
Cross sections A – A to be determined at 0.13 to 0.25mm from the leadtip.
6
Dimension "D" and "D2" does not include mold flash, protrusion or gate burrs.
7
Dimension "E1" and "E2" does not include interlead flash or protrusion.
MSOP
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