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參數(shù)資料
| 型號(hào)： | FAN2511 |
| 廠商： | Fairchild Semiconductor Corporation |
| 英文描述： | Terminal Block; No. of Positions:4; Pitch Spacing:5.08mm; Mounting Type:PC Board |
| 中文描述： | 一〇 〇毫安的CMOS LDO穩(wěn)壓器的快速啟動(dòng)功能 |
| 文件頁(yè)數(shù)： | 4/10頁(yè) |
| 文件大?。?/td> | 248K |
| 代理商： | FAN2511 |
PRODUCT SPECIFICATION
FAN2510/FAN2511
4
REV. 1.0.6 2/14/03
Thermal Characteristics
The FAN2510/11 is designed to supply 100mA at the speci-
fied output voltage with an operating die (junction) tempera-
ture of up to 125°C. Once the power dissipation and thermal
resistance is known, the maximum junction temperature of
the device can be calculated. While the power dissipation is
calculated from known electrical parameters, the thermal
resistance is a result of the thermal characteristics of the
compact SOT23-5 surface-mount package and the surround-
ing PC Board copper to which it is mounted.
The power dissipation is equal to the product of the input-to-
output voltage differential and the output current plus the
ground current multiplied by the input voltage, or:
The ground pin current I
provided in the Electrical Characteristics section.
GND
can be found in the charts
The relationship describing the thermal behavior of the
package is:
where T
ture of the die, which is 125°C, and T
ing temperature.
θ
JA
board layout and can be empirically obtained. While the
(junction-to-case) of the SOT23-5 package is specified at
130°C /W, the
θ
JA
of the minimum PWB footprint will be at
least 235°C /W. This can be improved upon by providing a
heat sink of surrounding copper ground on the PWB.
Depending on the size of the copper area, the resulting
can range from approximately 180°C /W for one square inch
to nearly 130°C /W for 4 square inches. The addition of
backside copper with through-holes, stiffeners, and other
enhancements can also aid in reducing this value. The heat
contributed by the dissipation of other devices located
nearby must be included in design considerations.
J(max)
is the maximum allowable junction tempera-
A
is the ambient operat-
is dependent on the surrounding PC
θ
JC
θ
JA
Once the limiting parameters in these two relationships have
been determined, the design can be modified to ensure that
the device remains within specified operating conditions. If
overload conditions are not considered, it is possible for the
device to enter a thermal cycling loop, in which the circuit
enters a shutdown condition, cools, re-enables, and then
again overheats and shuts down repeatedly due to an
unmanaged fault condition.
Operation of Adjustable Version
The adjustable version of the FAN2510/11 includes an input
pin ADJ which allows the user to select an output voltage
ranging from 1.8V to near V
IN
divider. The voltage V
ADJ
presented to the ADJ pin is fed to
the onboard error amplifier which adjusts the output voltage
until V
ADJ
is equal to the onboard bandgap reference voltage
of 1.32V(typ). The equation is:
, using an external resistor
The total value of the resistor chain should not exceed
250K
total to keep the error amplifier biased during
no-load conditions. Programming output voltages very near
V
IN
need to allow for the magnitude and variation of the
dropout voltage V
DO
over load, supply, and temperature
variations. Note that the low-leakage FET input to the
CMOS Error Amplifier induces no bias current error to the
calculation.
General PWB Layout Considerations
To achieve the full performance of the device, careful circuit
layout and grounding technique must be observed. Establish-
ing a small local ground, to which the GND pin, the output
and bypass capacitors are connected, is recommended, while
the input capacitor should be grounded to the main ground
plane. The quiet local ground is then routed back to the main
ground plane using feedthrough vias. In general, the high-
frequency compensation components (input, bypass, and
output capacitors) should be located as close to the device as
possible. The proximity of the output capacitor is especially
important to achieve optimal noise compensation from the
onboard error amplifier, especially during high load condi-
tions. A large copper area in the local ground will provide the
heat sinking discussed above when high power dissipation
significantly increases the temperature of the device.
Component-side copper provides significantly better thermal
performance for this surface-mount device, compared to that
obtained when using only copper planes on the underside.
P
D
V
IN
V
OUT
–
(
)
I
OUT
V
IN
I
GND
+
=
P
D max
)
T
-------------------------------
T
A
–
JA
=
V
OUT
1.32V
1
R
lower
R
+
×
=
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相關(guān)代理商/技術(shù)參數(shù) |
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| FAN2511S25 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:VOLT REGULATOR|FIXED|+2.5V|CMOS|TSOP|6PIN|PLASTIC |
| FAN2511S25X | 功能描述:低壓差穩(wěn)壓器 - LDO LDO Voltage RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類(lèi)型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| FAN2511S25X_Q | 功能描述:低壓差穩(wěn)壓器 - LDO LDO Voltage RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類(lèi)型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| FAN2511S26 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Positive Fixed Voltage Regulator |
| FAN2511S26X | 功能描述:低壓差穩(wěn)壓器 - LDO LDO Voltage RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類(lèi)型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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