參數(shù)資料
型號(hào): F74ALVC16245
廠商: Fairchild Semiconductor Corporation
英文描述: Low Voltage 16-Bit Bidirectional Transceiver with 3.6V Tolerant Inputs and Outputs
中文描述: 低電壓16位雙向收發(fā)器3.6V的輸入和輸出容錯(cuò)
文件頁(yè)數(shù): 1/7頁(yè)
文件大?。?/td> 120K
代理商: F74ALVC16245
2005 Fairchild Semiconductor Corporation
DS500678
www.fairchildsemi.com
October 2001
Revised May 2005
7
74ALVC16245
Low Voltage 16-Bit Bidirectional Transceiver
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16245 contains sixteen non-inverting bidirec-
tional buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is byte controlled. Each
byte has separate 3-STATE control inputs which can be
shorted together for full 16-bit operation. The T/R inputs
determine the direction of data flow through the device.
The OE inputs disable both the A and B ports by placing
them in a high impedance state.
The 74ALVC16245 is designed for low voltage (1.65V to
3.6V) V
CC
applications with I/O compatibility up to 3.6V.
The 74ALVC16245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
I
1.65V–3.6V V
CC
supply operation
I
3.6V tolerant inputs and outputs
I
t
PD
3.0 ns max for 3.0V to 3.6V V
CC
3.5 ns max for 2.3V to 2.7V V
CC
6.0 ns max for 1.65V to 1.95V V
CC
I
Power-down high impedance inputs and outputs
I
Supports live insertion/withdrawal (Note 1)
I
Uses patented noise/EMI reduction circuitry
I
Latchup conforms to JEDEC JED78
I
ESD performance:
Human body model
!
2000V
Machine model
!
200V
I
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1:
To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2:
Ordering code
G
indicates Trays.
Note 3:
Devices also available in Tape and Reel. Specify by appending the suffix letter
X
to the ordering code.
Logic Symbol
Order Number
74ALVC16245G
(Note 2)(Note 3)
74ALVC16245MTD
(Note 3)
Package Number
BGA54A
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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