- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄223756 > F0292C SINGLE COLOR LED, PURE GREEN, 0.17 mm PDF資料下載
參數(shù)資料
| 型號(hào)： | F0292C |
| 元件分類(lèi)： | LED |
| 英文描述： | SINGLE COLOR LED, PURE GREEN, 0.17 mm |
| 封裝： | DIE-2 |
| 文件頁(yè)數(shù)： | 3/7頁(yè) |
| 文件大?。?/td> | 89K |
| 代理商： | F0292C |
F 0292C
2003-04-07
3
Mechanische Werte
Mechanical values
Bezeichnung
Parameter
Symbol
Wert
Value
1)
Einheit
Unit
min.
typ.
max.
Chipkantenlnge (x-Richtung)
Length of chip edge (x-direction)
L
x
0.15
0.17
0.19
mm
Chipkantenlnge (y-Richtung)
Length of chip edge (y-direction)
L
y
0.15
0.17
0.19
mm
Durchmesser des Wafers
Diameter of the wafer
D
100
mm
Chiphhe
Die height
H
165
185
205
m
Bondpaddurchmesser
Diameter of bondpad
d
90
100
110
m
Weitere Informationen
Additional information
2)
Vorderseitenmetallisierung
Metallization frontside
Aluminium
Aluminum
Rückseitenmetallisierung
Metallization backside
Goldlegierung
Gold alloy
Trennverfahren
Dicing
Sgen
Sawing
Verbindung Chip - Trger
Die bonding
Kleben
Epoxy bonding
1)
Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.
This is not a specified value
2)
All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspection
A63501-Q0013-N001-*-76G3:
The visual inspection shall be made in accordance to the "specification of the visual inspection" as referenced.The
visual inspection of chip backside is performed with stereo microscope with incident light with 40x-80x magnification.
Areas > cm which have an amount of more than 3% failed dies will be removed. The visual inspection of chip
frontside is performed by a stereo microscope with incident light with 40x-80x magnification for 100% of the area of
each wafer. Areas > 1 cm which have an amount of more than 50% failed dies and areas > 2 cm which have an
amount of more than 25% failed dies will be removed. In areas with failure density higher than 1% each failure die is
inked individually. On request the visual inspection of chip frontside can be performed by an automated visual
inspection combined with automated inking additionally. The quality inspection (final visual inspection) is performed
by production. An additional visual inspection step as special release procedure by QM after the final visual inspection
is not installed.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| F036RNA-PSMSM-M26 | INTERCONNECTION DEVICE |
| F057A-PNMSE-1 | INTERCONNECTION DEVICE |
| F057A-PSMSR-20 | INTERCONNECTION DEVICE |
| F057A-PSRNFBH-90N | INTERCONNECTION DEVICE |
| F1-PNMSM-2M-HF | INTERCONNECTION DEVICE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| F02971-000 | 制造商:TE Connectivity 功能描述:VARISTOR 150VDC 7MM STRGT LEAD 制造商:TE Connectivity 功能描述:VARISTOR 150V 1.2KA DISC 7MM 制造商:TE CONNECTIVITY RAYCHEM-POLYSWITCH 功能描述:Var MOV 95VAC 125VDC 1200A 150V Thru-Hole T/R |
| F-029-C | 制造商:WALDOM ELECTRONICS 功能描述: 制造商:GC Electronics 功能描述: |
| F02A080-RED | 制造商:AE PETSCHE 功能描述:High Voltage 18 awg, cr-ptfe insulation, red |
| F02A-1/100A | 制造商:Cooper Bussmann 功能描述: |
| F02A-1/16A | 制造商:Cooper Bussmann 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。