3-4 Revision 10 Datasheet Categories Categories In order to provide the latest information to designers, some datashe" />
參數(shù)資料
型號: EX64-TQ64
廠商: Microsemi SoC
文件頁數(shù): 41/48頁
文件大小: 0K
描述: IC FPGA ANTIFUSE 3K 64-TQFP
標準包裝: 160
系列: EX
邏輯元件/單元數(shù): 128
輸入/輸出數(shù): 41
門數(shù): 3000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 64-LQFP
供應商設(shè)備封裝: 64-TQFP(10x10)
Datasheet Information
3-4
Revision 10
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "eX Device Status" table on page II, is designated as either "Product Brief," "Advance,"
"Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The product described in this datasheet is subject to the Export Administration Regulations (EAR). They
could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EX64-TQ64A 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
EX64-TQ64I 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
EX64-TQG100 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
EX64-TQG100A 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
EX64-TQG100I 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)