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參數(shù)資料
| 型號： | EVAL-ADV7619EB1Z |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 23/24頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADV7619 |
| 標準包裝： | 1 |
| 系列： | Advantiv®, Xpressview™ |
| 主要目的： | 視頻，HDMI 接收器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADV7619 |
| 主要屬性： | 雙端口，3 GHz HDMI 接收器 |
| 已供物品： | 板 |
ADV7619
Data Sheet
Rev. C | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
DVDD to GND
2.2 V
PVDD to GND
2.2 V
DVDDIO to GND
4.0 V
CVDD to GND
2.2 V
TVDD to GND
4.0 V
Digital Inputs to GND
GND 0.3 V to DVDDIO + 0.3 V
5 V Tolerant Digital Inputs
to GND1
5.3 V
Digital Outputs to GND
GND 0.3 V to DVDDIO + 0.3 V
XTALP, XTALN
0.3 V to PVDD + 0.3 V
SCL, SDA Data Pins to
DVDDIO
DVDDIO 0.3 V to DVDDIO + 3.6 V
Maximum Junction
Temperature (TJ MAX)
125°C
Storage Temperature Range
60°C to +150°C
Infrared Reflow Soldering
(20 sec)
260°
1
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,
DDCA_SDA, DDCB_SCL, and DDCB_SDA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7619, the
user is advised to turn off the unused sections of the part.
Due to PCB metal variation and, therefore, variation in PCB
heat conductivity, the value of θJA may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this solution eliminates the variance associated with
the θJA value.
The maximum junction temperature (TJ MAX) of 125°C must not
be exceeded. The following equation calculates the junction
temperature using the measured package surface temperature
and applies only when no heat sink is used on the device under
test (DUT):
TJ = TS + (ΨJT × WTOTAL)
where:
TS is the package surface temperature (°C).
ΨJT = 0.22°C/W for the 128-lead TQFP_EP.
WTOTAL = ((PVDD × IPVDD) + (0.2 × TVDD × ITVDD) +
(CVDD × ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO))
where 0.2 is 20% of the TVDD power that is dissipated on the
part itself.
ESD CAUTION
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