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參數(shù)資料
| 型號(hào)： | EVAL-ADMP521Z-FLEX |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 6/17頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADMP521Z |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | iMEMS® |
| 主要目的： | 音頻，MEMS 全向麥克風(fēng) |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADMP521 |
| 主要屬性： | 數(shù)字輸出 |
| 已供物品： | 板 |
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Data Sheet
ADMP521
Rev. A | Page 13 of 16
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-
place and chip shooting equipment. Take care to avoid damage to
the MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
Use care during pick-and-place to ensure that no high shock
events above 10 kg are experienced because such events
may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
REFLOW SOLDER
For best results, the soldering profile should be in accordance with
the recommendations of the manufacturer of the solder paste used
to attach the MEMS microphone to the PCB. It is recommended
that the solder reflow profile not exceed the limit conditions
specified in Figure 4 and Table 4.
BOARD WASH
When washing the PCB, ensure that water does not make contact
with the microphone port. Do not use blow-off procedures and
ultrasonic cleaning.
OBSOLETE
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