參數(shù)資料
型號: EPM9560ARI208-10
廠商: Altera
文件頁數(shù): 4/46頁
文件大?。?/td> 0K
描述: IC MAX 9000 CPLD 560 208-RQFP
產(chǎn)品變化通告: Package Change 30/Jun/2010
標(biāo)準(zhǔn)包裝: 48
系列: Max® 9000
可編程類型: 系統(tǒng)內(nèi)可編程
最大延遲時(shí)間 tpd(1): 10.0ns
電壓電源 - 內(nèi)部: 4.5 V ~ 5.5 V
邏輯元件/邏輯塊數(shù)目: 35
宏單元數(shù): 560
門數(shù): 12000
輸入/輸出數(shù): 153
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 208-BFQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 208-RQFP(28x28)
包裝: 托盤
其它名稱: 544-2364
12
Altera Corporation
MAX 9000 Programmable Logic Device Family Data Sheet
The MAX+PLUS II Compiler automatically allocates as many as three sets
of up to five parallel expanders to macrocells that require additional
product terms. Each set of expanders incurs a small, incremental timing
delay (tPEXP). For example, if a macrocell requires 14 product terms, the
Compiler uses the five dedicated product terms within the macrocell and
allocates two sets of parallel expanders; the first set includes five product
terms and the second set includes four product terms, increasing the total
delay by 2
× t
PEXP.
Two groups of eight macrocells within each LAB (e.g., macrocells 1
through 8 and 9 through 16) form two chains to lend or borrow parallel
expanders. A macrocell borrows parallel expanders from lower-
numbered macrocells. For example, macrocell 8 can borrow parallel
expanders from macrocell 7, from macrocells 7 and 6, or from macrocells
7, 6, and 5. Within each group of 8, the lowest-numbered macrocell can
only lend parallel expanders and the highest-numbered macrocell can
only borrow them.
FastTrack Interconnect
In the MAX 9000 architecture, connections between macrocells and device
I/O pins are provided by the FastTrack Interconnect, a series of
continuous horizontal and vertical routing channels that traverse the
entire device. This device-wide routing structure provides predictable
performance even in complex designs. In contrast, the segmented routing
in FPGAs requires switch matrices to connect a variable number of
routing paths, increasing the delays between logic resources and reducing
performance. Figure 6 shows the interconnection of four adjacent LABs
with row and column interconnects.
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