參數(shù)資料
型號(hào): EPM7064BTC100-5
廠商: Altera
文件頁數(shù): 6/66頁
文件大小: 0K
描述: IC MAX 7000 CPLD 64 100-TQFP
標(biāo)準(zhǔn)包裝: 270
系列: MAX® 7000B
可編程類型: 系統(tǒng)內(nèi)可編程
最大延遲時(shí)間 tpd(1): 5.0ns
電壓電源 - 內(nèi)部: 2.375 V ~ 2.625 V
邏輯元件/邏輯塊數(shù)目: 4
宏單元數(shù): 64
門數(shù): 1250
輸入/輸出數(shù): 68
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 100-TQFP
供應(yīng)商設(shè)備封裝: 100-TQFP(14x14)
包裝: 托盤
14
Altera Corporation
MAX 7000B Programmable Logic Device Data Sheet
SameFrame
Pin-Outs
MAX 7000B devices support the SameFrame pin-out feature for
FineLine BGA and 0.8-mm Ultra FineLine BGA packages. The
SameFrame pin-out feature is the arrangement of balls on FineLine BGA
and 0.8-mm Ultra FineLine BGA packages such that the lower-ball-count
packages form a subset of the higher-ball-count packages. SameFrame
pin-outs provide the flexibility to migrate not only from device to device
within the same package, but also from one package to another. FineLine
BGA packages are compatible with other FineLine BGA packages, and
0.8-mm Ultra FineLine BGA packages are compatible with other 0.8-mm
Ultra FineLine BGA packages. A given printed circuit board (PCB) layout
can support multiple device density/package combinations. For example,
a single board layout can support a range of devices from an EPM7064B
device in a 100-pin FineLine BGA package to an EPM7512B device in a
256-pin FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to layout a board to
take advantage of this migration (see Figure 7).
Figure 7. SameFrame Pin-Out Example
Designed for 256-Pin FineLine BGA Package
Printed Circuit Board
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
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