參數(shù)資料
型號： EPF6024AFI256-2
廠商： Altera
文件頁數(shù)： 12/52頁
文件大小： 0K
描述： IC FLEX 6000 FPGA 24K 256-FBGA
標(biāo)準(zhǔn)包裝： 90
系列： FLEX 6000
LAB/CLB數(shù)： 196
邏輯元件/單元數(shù)： 1960
輸入/輸出數(shù)： 219
門數(shù)： 24000
電源電壓： 3 V ~ 3.6 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 256-BGA
供應(yīng)商設(shè)備封裝： 256-FBGA（17x17）
2
Altera Corporation
FLEX 6000 Programmable Logic Device Family Data Sheet
...and More
Features
■
Powerful I/O pins
–
Individual tri-state output enable control for each pin
–
Programmable output slew-rate control to reduce switching
noise
–
Fast path from register to I/O pin for fast clock-to-output time
■
Flexible interconnect
–FastTrack Interconnect continuous routing structure for fast,
predictable interconnect delays
–
Dedicated carry chain that implements arithmetic functions such
as fast adders, counters, and comparators (automatically used by
software tools and megafunctions)
–
Dedicated cascade chain that implements high-speed, high-fan-
in logic functions (automatically used by software tools and
megafunctions)
–
Tri-state emulation that implements internal tri-state networks
–
Four low-skew global paths for clock, clear, preset, or logic
signals
■
Software design support and automatic place-and-route provided by
Altera’s development system for Windows-based PCs, Sun
SPARCstations, and HP 9000 Series 700/800
■
Flexible package options
–
Available in a variety of packages with 100 to 256 pins, including
the innovative FineLine BGATM packages (see Table 2)
–SameFrameTM pin-compatibility (with other FLEX 6000 devices)
across device densities and pin counts
–
Thin quad flat pack (TQFP), plastic quad flat pack (PQFP), and
ball-grid array (BGA) packages (see Table 2)
–
Footprint- and pin-compatibility with other FLEX 6000 devices
in the same package
■
Additional design entry and simulation support provided by
EDIF 2 0 0 and 3 0 0 netlist files, the library of parameterized modules
(LPM), Verilog HDL, VHDL, DesignWare components, and other
interfaces to popular EDA tools from manufacturers such as
Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys,
Synplicity, VeriBest, and Viewlogic
Table 2. FLEX 6000 Package Options & I/O Pin Count
Device
100-Pin
TQFP
100-Pin
FineLine BGA
144-Pin
TQFP
208-Pin
PQFP
240-Pin
PQFP
256-Pin
BGA
256-pin
FineLine BGA
EPF6010A
71
102
EPF6016
117
171
199
204
EPF6016A
81
117
171
EPF6024A
117
171
199
218
219
相關(guān)PDF資料
PDF描述
EPF6024ABI256-2 IC FLEX 6000 FPGA 24K 256-BGA
AMM28DTBT CONN EDGECARD 56POS R/A .156 SLD
EPF6016AQI208-2 IC FLEX 6000 FPGA 16K 208-PQFP
AMM28DTAT CONN EDGECARD 56POS R/A .156 SLD
ABC60DRYI-S734 CONN EDGECARD 120PS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF6024AQC208-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-1N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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