參數(shù)資料
型號: EPF10K30ETI144-2
廠商: Altera
文件頁數(shù): 7/100頁
文件大小: 0K
描述: IC FLEX 10KE FPGA 30K 144-TQFP
產(chǎn)品培訓模塊: Three Reasons to Use FPGA's in Industrial Designs
標準包裝: 180
系列: FLEX-10KE®
LAB/CLB數(shù): 216
邏輯元件/單元數(shù): 1728
RAM 位總計: 24576
輸入/輸出數(shù): 102
門數(shù): 119000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 144-LQFP
供應商設備封裝: 144-TQFP(20x20)
其它名稱: 544-1944
EPF10K30ETI144-2-ND
14
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
When used as RAM, each EAB can be configured in any of the following
sizes: 256
× 16, 512 × 8, 1,024 × 4, or 2,048 × 2 (see Figure 5).
Figure 5. FLEX 10KE EAB Memory Configurations
Larger blocks of RAM are created by combining multiple EABs. For
example, two 256
× 16 RAM blocks can be combined to form a 256 × 32
block; two 512
× 8 RAM blocks can be combined to form a 512 × 16 block
Figure 6. Examples of Combining FLEX 10KE EABs
If necessary, all EABs in a device can be cascaded to form a single RAM
block. EABs can be cascaded to form RAM blocks of up to 2,048 words
without impacting timing. The Altera software automatically combines
EABs to meet a designer’s RAM specifications.
256
× 16
512
× 8
1,024
× 4
2,048
× 2
512
× 8
512
× 8
256
× 16
256
× 16
256
× 32
512
× 16
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參數(shù)描述
EPF10K30ETI144-2DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC
EPF10K30ETI144-2N 制造商:Altera Corporation 功能描述:
EPF10K30ETI144-3DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC
EPF10K30RC208-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30RC208-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256