參數(shù)資料
型號(hào)： EPF10K30EQC208-2X
廠商： Altera
文件頁(yè)數(shù)： 21/100頁(yè)
文件大小： 0K
描述： IC FLEX 10KE FPGA 30K 208-PQFP
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 72
系列： FLEX-10KE®
LAB/CLB數(shù)： 216
邏輯元件/單元數(shù)： 1728
RAM 位總計(jì)： 24576
輸入/輸出數(shù)： 147
門(mén)數(shù)： 119000
電源電壓： 2.375 V ~ 2.625 V
安裝類(lèi)型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
Altera Corporation
27
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
FastTrack Interconnect Routing Structure
In the FLEX 10KE architecture, connections between LEs, EABs, and
device I/O pins are provided by the FastTrack Interconnect routing
structure, which is a series of continuous horizontal and vertical routing
channels that traverses the device. This global routing structure provides
predictable performance, even in complex designs. In contrast, the
segmented routing in FPGAs requires switch matrices to connect a
variable number of routing paths, increasing the delays between logic
resources and reducing performance.
The FastTrack Interconnect routing structure consists of row and column
interconnect channels that span the entire device. Each row of LABs is
served by a dedicated row interconnect. The row interconnect can drive
I/O pins and feed other LABs in the row. The column interconnect routes
signals between rows and can drive I/O pins.
Row channels drive into the LAB or EAB local interconnect. The row
signal is buffered at every LAB or EAB to reduce the effect of fan-out on
delay. A row channel can be driven by an LE or by one of three column
channels. These four signals feed dual 4-to-1 multiplexers that connect to
two specific row channels. These multiplexers, which are connected to
each LE, allow column channels to drive row channels even when all eight
LEs in a LAB drive the row interconnect.
Each column of LABs or EABs is served by a dedicated column
interconnect. The column interconnect that serves the EABs has twice as
many channels as other column interconnects. The column interconnect
can then drive I/O pins or another row’s interconnect to route the signals
to other LABs or EABs in the device. A signal from the column
interconnect, which can be either the output of a LE or an input from an
I/O pin, must be routed to the row interconnect before it can enter a LAB
or EAB. Each row channel that is driven by an IOE or EAB can drive one
specific column channel.
Access to row and column channels can be switched between LEs in
adjacent pairs of LABs. For example, a LE in one LAB can drive the row
and column channels normally driven by a particular LE in the adjacent
LAB in the same row, and vice versa. This flexibility enables routing
resources to be used more efficiently (see Figure 13).
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K30EQC208-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30EQC208-3DX 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:ASIC
EPF10K30EQC208-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K30EQI208-1DX 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:ASIC
EPF10K30EQI208-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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