
Altera Corporation
16–15
May 2007
Stratix II GX Device Handbook, Volume 2
Package Information for Stratix II & Stratix II GX Devices
1,508-Pin FBGA - Flip Chip
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All dimensions and tolerances conform to ASME Y14.5M - 1994.
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Controlling dimension is in millimeters.
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Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
outline figure references, respectively, for the 1,508-pin FBGA packaging.
Table 16–17. 1,508-Pin FBGA Package Information
Description
Specification
Ordering code reference
F
Package acronym
FBGA
Substrate material
BT
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC outline reference
MS-034
Variation: AAU-1
Maximum lead coplanarity
0.008 inches (0.20 mm)
Weight
14.6 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 16–18. 1,508-Pin FBGA Package Outline Dimensions
Symbol
Millimeters
Min.
Nom.
Max.
A–
–
3.50
A1
0.30
–
A2
0.25
–
3.00
A3
–
2.50
D
40.00 BSC
E
40.00 BSC
b
0.50
0.60
0.70
e
1.00 BSC