參數(shù)資料
型號: EP2SGX60DF780C5N
廠商: Altera
文件頁數(shù): 212/1486頁
文件大?。?/td> 0K
描述: IC STRATIX II GX 60K 780-FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 9
系列: Stratix® II GX
LAB/CLB數(shù): 3022
邏輯元件/單元數(shù): 60440
RAM 位總計(jì): 2544192
輸入/輸出數(shù): 364
電源電壓: 1.15 V ~ 1.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 780-BBGA
供應(yīng)商設(shè)備封裝: 780-FBGA(29x29)
其它名稱: 544-1762
Altera Corporation
10–1
October 2007
10. Selectable I/O Standards
in Stratix II and Stratix II GX
Devices
Introduction
This chapter provides guidelines for using industry I/O standards in
Stratix II and Stratix II GX devices, including:
I/O features
I/O standards
External memory interfaces
I/O banks
Design considerations
Stratix II and
Stratix II GX I/O
Features
Stratix II and the Stratix II GX devices contain an abundance of adaptive
logic modules (ALMs), embedded memory, high-bandwidth digital
signal processing (DSP) blocks, and extensive routing resources, all of
which can operate at very high core speed.
Stratix II and Stratix II GX devices I/O structure is designed to ensure
that these internal capabilities are fully utilized. There are numerous I/O
features to assist in high-speed data transfer into and out of the device
including:
Single-ended, non-voltage-referenced and voltage-referenced I/O
standards
High-speed differential I/O standards featuring
serializer/deserializer (SERDES), dynamic phase alignment (DPA),
capable of 1 gigabit per second (Gbps) performance for low-voltage
differential signaling (LVDS), Hypertransport technology, HSTL,
SSTL, and LVPECL
1
HSTL and SSTL I/O standards are used only for PLL clock
inputs and outputs in differential mode. LVPECL is
supported on clock input and outputs of the top and bottom
I/O banks.
Double data rate (DDR) I/O pins
Programmable output drive strength for voltage-referenced and
non-voltage-referenced single-ended I/O standards
Programmable bus-hold
Programmable pull-up resistor
Open-drain output
On-chip series termination
On-chip parallel termination
SII52004-4.6
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EP2SGX60DF780I4 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix II GX 3022 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2SGX60DF780I4N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix II GX 3022 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2SGX60E 制造商:ALTERA 制造商全稱:Altera Corporation 功能描述:Stratix II GX Device
EP2SGX60EF1152C3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix II GX 3022 LABs 534 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2SGX60EF1152C3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix II GX 3022 LABs 534 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256