參數(shù)資料
型號(hào): EP2AGX65DF29I3N
廠商: Altera
文件頁(yè)數(shù): 11/90頁(yè)
文件大?。?/td> 0K
描述: IC ARRIA II GX FPGA 65K 780FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 4
系列: Arria II GX
LAB/CLB數(shù): 2530
邏輯元件/單元數(shù): 60214
RAM 位總計(jì): 5371904
輸入/輸出數(shù): 364
電源電壓: 0.87 V ~ 0.93 V
安裝類(lèi)型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 780-BBGA
供應(yīng)商設(shè)備封裝: 780-FBGA(29x29)
其它名稱: 544-2702
Chapter 1: Device Datasheet for Arria II Devices
1–11
Electrical Characteristics
December 2013
Altera Corporation
The calibration accuracy for calibrated series and parallel OCTs are applicable at the
moment of calibration. When process, voltage, and temperature (PVT) conditions
change after calibration, the tolerance may change.
Table 1–13 lists the Arria II GZ OCT without calibration resistance tolerance to PVT
changes.
OCT calibration is automatically performed at power up for OCT-enabled I/Os.
When voltage and temperature conditions change after calibration, the resistance may
change. Use Equation 1–1 and Table 1–14 to determine the OCT variation when
voltage and temperature vary after power-up calibration for Arria II GX and GZ
devices.
Table 1–13. OCT Without Calibration Resistance Tolerance Specifications for Arria II GZ Devices
Symbol
Description
Conditions (V)
Resistance Tolerance
Unit
C3,I3
C4,I4
25-
R
S
3.0 and 2.5
25-
internal series
OCT without
calibration
VCCIO = 3.0, 2.5
± 40
%
25-
R
S
1.8 and 1.5
25-
internal series
OCT without
calibration
VCCIO = 1.8, 1.5
± 40
%
25-
R
S
1.2
25-
internal series
OCT without
calibration
VCCIO = 1.2
± 50
%
50-
R
S
3.0 and 2.5
50-
internal series
OCT without
calibration
VCCIO = 3.0, 2.5
± 40
%
50-
R
S
1.8 and 1.5
50-
internal series
OCT without
calibration
VCCIO = 1.8, 1.5
± 40
%
50-
R
S
1.2
50-
internal series
OCT without
calibration
VCCIO = 1.2
± 50
%
100-
R
D
2.5
100-
internal
differential OCT
VCCIO = 2.5
± 25
%
Equation 1–1. OCT Variation (Note 1)
(1) ROCT value calculated from Equation 1–1shows the range of OCT resistance with the variation of temperature and
VCCIO.
ROCT
RSCAL 1
dR
dT
-------
T
dR
dV
-------
V
+
=
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EP2AGX65DF29I5 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX65DF29I5N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX95DF25C4 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX95DF25C4N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX95DF25C5 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256