
16–20
Altera Corporation
Stratix GX Device Handbook, Volume 2
June 2006
Stratix & Stratix GX I/O Banks
(1)
Figure 16–18 is a top view of the silicon die. This corresponds to a top-down view for non-flip-chip packages, but is
a reverse view for flip-chip packages.
(2)
Figure 16–18 is a graphic representation only. See the pin list and the Quartus II software for exact locations.
(3)
Banks 9 through 12 are enhanced PLL external clock output banks.
(4)
If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the
I/O standards except HSTL Class II, GTL, SSTL-18 Class II, PCI, PCI-X 1.0, and AGP 1×/2×.
(5)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
I/O Banks 3, 4, 9 & 10 Support
All Single-Ended I/O Standards
I/O Banks 7, 8, 11 & 12 Support
All Single-Ended I/O Standards
I/O Banks 1, 2, 5, and 6 Support All
Single-Ended I/O Standards Except
Differential HSTL Output Clocks,
Differential SSTL-2 Output Clocks,
HSTL Class II, GTL, SSTL-18 Class II,
PCI, PCI-X 1.0, and AGP 1
×/2×
DQS9T
DQS8T
DQS7T
DQS6T
DQS5T
DQS4T
DQS3T
DQS2T
DQS1T
DQS0T
PLL5
VREF1B3
VREF2B3
VREF3B3
VREF4B3
VREF5B3
VREF1B4
VREF2B4
VREF3B4
VREF4B4
VREF5B4
VREF5B8
VREF4B8
VREF3B8
VREF2B8
VREF1B8
VREF5B7
VREF4B7
VREF3B7
VREF2B7
VREF1B7
PLL6
DQS9B
DQS8B
DQS7B
DQS6B
DQS5B
DQS4B
DQS3B
DQS2B
DQS1B
DQS0B
910
VREF1B2
VREF2B2
VREF3B2
VREF4B2
VREF1B1
VREF2B1
VREF3B1
VREF4B1
VREF4B6
VREF3B6
VREF2B6
VREF1B6
VREF4B5
VREF3B5
VREF2B5
VREF1B5
Bank
5
Bank
6
PLL3
PLL4
PLL1
PLL2
Bank
1
Bank
2
Bank 3
Bank 4
11
12
Bank 8
Bank 7
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
PLL7
PLL10
PLL8
PLL9
PLL12
PLL11
(5)