參數資料
型號: EL7156CS-T13
英文描述: High Performance Pin Driver
中文描述: 高性能管腳驅動
文件頁數: 10/10頁
文件大小: 210K
代理商: EL7156CS-T13
9
EL7156C
High Performance Pin Driver
EL
7156C
power dissipation for a given application prior to select-
ing the package type.
Power dissipation may be calculated:
where:
VS is the total power supply to the EL7156C (from
VS+ to GND),
Vout is the swing on the output (VH - VL),
CL is the load capacitance,
CINT is the internal load capacitance (50pF max.),
IS is the quiescent supply current (3mA max.) and
f is frequency
Having obtained the application’s power dissipation, a
maximum package thermal coefficient may be deter-
mined, to maintain the internal die temperature below
Tjmax:
where:
Tjmax is the maximum junction temperature (125°C),
Tmax is the maximum operating temperature,
PD is the power dissipation calculated above,
θja thermal resistance on junction to ambient.
θja is 160°C/W for the SO8 package and 100°C/W for
the PDIP8 package when using a standard JEDEC
JESD51-3 single-layer test board. If Tjmax is greater than
125°C when calculated using the equation above, then
one of the following actions must be taken:
Reduce
θja the system by designing more heat-sinking
into the PCB (as compared to the standard JEDEC
JESD51-3)
Use the PDIP8 instead of the SO8 package
De-rate the application either by reducing the switch-
ing frequency, the capacitive load, or the maximum
operating (ambient) temperature (Tmax)
PD
V
S
(
I
S )
C
INT
(
V
S
2
f
)
C
L
(
V
OU T
2
f
)
×
+
×
+
×
=
θ
ja
T
jmax
T
ma x
PD
--------------------------------
=
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