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參數資料
型號: EL5211AIYEZ-T13
廠商: Intersil
文件頁數: 2/12頁
文件大小: 0K
描述: IC AMP DUAL R-R I/O 60MHZ 8HMSOP
標準包裝: 2,500
放大器類型: 電壓反饋
電路數: 2
輸出類型: 滿擺幅
轉換速率: 75 V/µs
增益帶寬積: 32MHz
-3db帶寬: 60MHz
電流 - 輸入偏壓: 2nA
電壓 - 輸入偏移: 3000µV
電流 - 電源: 5mA
電流 - 輸出 / 通道: 65mA
電壓 - 電源,單路/雙路(±): 4.5 V ~ 16.5 V,±2.25 V ~ 8.25 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-VSSOP,8-MSOP(0.118",3.00mm 寬)裸露焊盤
供應商設備封裝: 8-HMSOP
包裝: 帶卷 (TR)
10
FN6143.2
July 23, 2009
Output Phase Reversal
The EL5211A is immune to phase reversal as long as the input
voltage is limited from VS- -0.5V to VS+ +0.5V. Figure 28 shows
a photo of the output of the device with the input voltage driven
beyond the supply rails. Although the device's output will not
change phase, the input's overvoltage should be avoided. If an
input voltage exceeds supply voltage by more than 0.6V,
electrostatic protection diodes placed in the input stage of the
device begin to conduct and overvoltage damage could occur.
Power Dissipation
With the high-output drive capability of the EL5211A
amplifier, it is possible to exceed the +150°C absolute
maximum junction temperature under certain load current
conditions. Therefore, it is important to calculate the
maximum junction temperature for the application to
determine if load conditions need to be modified for the
amplifier to remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to Equation 1:
where:
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
Θ
JA = Thermal resistance of the package
PDMAX = Maximum power dissipation in the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
when sourcing, and:
when sinking,
where:
i = 1 to 2 for dual and 1 to 4 for quad
VS = Total supply voltage
ISMAX = Maximum supply current per amplifier
VOUTi = Maximum output voltage of the application
ILOADi = Load current
If we set the two PDMAX equations equal to each other, we
can solve for RLOADi to avoid device overheat. Figures 29
and 30 provide a convenient way to see if the device will
overheat. The maximum safe power dissipation can be found
graphically, based on the package type and the ambient
temperature. By using the Equation 3, it is a simple matter to
see if PDMAX exceeds the device's power derating curves. To
ensure proper operation, it is important to observe the
recommended derating curves shown in Figures 29 and 30.
FIGURE 29. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
1V
10s
FIGURE 28. OPERATION WITH BEYOND-THE-RAILS INPUT
VS = ±2.5V
TA = +25°C
AV = 1
VIN = 6VP-P
P
DMAX
T
JMAX
T
AMAX
Θ
JA
---------------------------------------------
=
(EQ. 1)
P
DMAX
ΣiV
[
S
I
SMAX
V
(
S+VOUTi )
I
LOAD i
×
+
×]
=
(EQ. 2)
P
DMAX
ΣiV
[
S
I
SMAX
V
(
OUTiVS- )
I
LOADi
×
+
×]
=
(EQ. 3)
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.6
0.4
0.3
0.2
0.1
0
25
50
75
100
125
AMBIENT TEMPERATURE (°C)
POWER
D
ISS
IP
AT
ION
(W)
85
556mW
0.5
HMSOP8
θ
JA = 225°C/W
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
2.5
1.5
1.0
0.5
0
25
50
75
100
125
AMBIENT TEMPERATURE (°C)
POWER
D
ISS
IP
AT
ION
(W)
85
2.16W
2.0
HMSOP8
θJA = 58°C/W
EL5211A
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