參數(shù)資料
型號: EL1517AIYE-T7
廠商: Intersil
文件頁數(shù): 9/10頁
文件大?。?/td> 0K
描述: IC LINE DRIVER XDSL DIFF 10-MSOP
標準包裝: 1,500
類型: 驅(qū)動器
驅(qū)動器/接收器數(shù): 1/0
規(guī)程: DSL
電源電壓: 5 V ~ 12 V
安裝類型: 表面貼裝
封裝/外殼: 10-VFSOP,10-MSOP(0.118",3.00mm 寬)裸露焊盤
供應(yīng)商設(shè)備封裝: 10-HMSOP
包裝: 帶卷 (TR)
8
FN6139.2
August 8, 2006
FIGURE 31. TRANSIMPEDANCE vs TEMPERATURE
FIGURE 32. OUTPUT VOLTAGE vs TEMPERATURE
FIGURE 33. SUPPLY CURRENT vs TEMPERATURE
FIGURE 34. DIFFERENTIAL PEAKING vs SUPPLY VOLTAGE
FIGURE 35. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 36. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Typical Performance Curves (Continued)
-50
0
100
150
TEMPERATURE (°C)
3
2.5
1.5
0.5
0
TRANSIMPEDANCE
(M
)
2
1
50
125
-25
25
75
VS=±6V
RL=100
-50
0
100
150
TEMPERATURE (°C)
5.1
5.05
4.95
4.85
4.75
O
U
TP
UT
VO
L
T
AGE
(±V)
5
4.9
50
125
-25
25
75
4.8
-50
0
100
150
TEMPERATURE (°C)
16
15.5
14.5
13
12
SUPP
L
Y
CURRENT
(m
A)
14
13.5
50
125
-25
25
75
12.5
15
AV=5
RF=750
RL=100 DIFF
2.5
3.5
5.5
6
VS (±V)
3
2
0
-1
P
E
AKING
(
d
B)
4.5
34
5
1
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1
0.8
0.4
0.2
0
P
O
WER
DIS
S
IPATION
(W)
1.000W
θ
JA =
12
5°C
/W
HM
SO
P1
0
0.6
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
125
85
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HMSOP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
4.5
4
3.5
2
1.5
0.5
0
255075
100
150
AMBIENT TEMPERATURE (°C)
P
O
WER
DIS
S
IPATION
(W)
3.125W
θ
JA =
40°
C/W
HM
SO
P1
0
125
85
2.5
1
3
EL1517A
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