參數(shù)資料
型號: EFM32LG230F256
廠商: Energy Micro
文件頁數(shù): 52/65頁
文件大?。?/td> 0K
描述: IC MCU 32BIT 256KB FLASH 64QFN
標(biāo)準(zhǔn)包裝: 1
系列: Leopard Gecko
核心處理器: ARM? Cortex?-M4
芯體尺寸: 32-位
速度: 48MHz
連通性: I²C,IrDA,智能卡,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 56
程序存儲器容量: 256KB(256K x 8)
程序存儲器類型: 閃存
RAM 容量: 32K x 8
電壓 - 電源 (Vcc/Vdd): 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b,D/A 2x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 64-VFQFN 裸露焊盤
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: 914-1053-6
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32LG230FXX - d0105_Rev1.10
56
www.energymicro.com
Figure 5.3. QFN64 PCB Stencil Design
e
a
d
c
b
x
y
z
Table 5.3. QFN64 PCB Stencil Design Dimensions (Dimensions in mm)
Symbol
Dim. (mm)
Symbol
Dim. (mm)
a
0.75
e
8.90
b
0.22
x
2.70
c
0.50
y
2.70
d
8.90
z
0.80
1. The drawings are not to scale.
2. All dimensions are in millimeters.
3. All drawings are subject to change without notice.
4. The PCB Land Pattern drawing is in compliance with IPC-7351B.
5. Stencil thickness 0.125 mm.
6. For detailed pin-positioning, see Figure 4.3 (p. 52) .
5.2 Soldering Information
The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.
The packages have a Moisture Sensitivity Level rating of 3, please see the latest IPC/JEDEC J-STD-033
standard for MSL description and level 3 bake conditions.
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