參數(shù)資料
型號(hào): EE-SX4134
廠商: Omron Electronics LLC
英文描述: Photomicrosensor (Transmissive)
中文描述: Photomicrosensor(透射)
文件頁(yè)數(shù): 4/5頁(yè)
文件大?。?/td> 522K
代理商: EE-SX4134
EE-SX4134
EE-SX4134
Precautions
Soldering Information
Reflow soldering
The following soldering paste is recommended:
Melting temperature: 178 to 192
°
C
Composition: Sn 63%, Pb 37%
The recommended thickness of the metal mask for screen
printing is between 0.2 and 0.25 mm.
Set the reflow oven so that the temperature profile shown in the
following chart is obtained for the upper surface of the product
being soldered.
10 sec. max.
230
°
C max.
Time
60 to 120 sec
T
4
°
C/s max.
40 sec. max.
4
°
C/s max.
140 to 160
°
C
Manual soldering
Use”Sn60”(60%tinand40%lead)orsolderwithsilvercontent.
Useasolderingironoflessthan25W,andkeepthetemperature
of the iron tip at 300
°
C or below.
Solder each point for a maximum of three seconds.
After soldering, allow the product to return to room temperature
before handling it.
Storage
To protect theproduct from the effects of humidity until the package
is opened, dry-box storage is recommended. If this is not possible,
store the product under the following conditions:
Temperature: 10 to 30
°
C
Humidity: 60% max.
Theproduct is packed in a humidity-proof envelope. Reflow solder-
ingmustbedonewithin48hoursafteropeningtheenvelope,during
whichtimetheproductmustbestoredunder30
°
Cat80%maximum
humidity.
Ifitisnecessarytostoretheproductafteropeningtheenvelope,use
dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for
six months or more, or if more than 48 hours have lapsed since the
envelope was opened, bake the product under the following condi-
tions before use:
Reel: 60
°
C for 24 hours or more
Bulk: 80
°
C for 4 hours or more
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