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參數(shù)資料
| 型號(hào)： | EC2600ETTTS-50.0013M |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 50.0013 MHz, LVCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, CERAMIC, SMD, 4 PIN |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 126K |
| 代理商： | EC2600ETTTS-50.0013M |
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.DATE
ECLIPTEK CORP.
OSCILLATOR
EC26
CERAMIC
3.3V
OS30
02/10
EC26 00 ET T TS - 40.000M TR
FREQUENCY TOLERANCE / STABILITY
00=±100ppm Maximum
45=±50ppm Maximum
25=±25ppm Maximum
20=±20ppm Maximum
OPERATING TEMPERATURE RANGE
Blank = -10°C to +70°C
ET = -40°C to +85°C
PACKAGING OPTIONS
Blank = Bulk
TR = Tape & Reel
FREQUENCY
OUTPUT CONTROL FUNCTION
TS = Tri-State
DUTY CYCLE
Blank = 50 ±10(%)
T = 50 ±5(%)
PART NUMBERING GUIDE
*Compliant to EIA 481A
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
Tolerances = ±0.1
Line 1: ECLIPTEK
Line 2: XX.XXX M
Frequency in MHz (5 Digits Maximum + Decimal)
Line 3: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
Pin 1: Tri-State
Pin 2: Case Ground
Pin 3: Output
Pin 4: Supply Voltage
M
N
O
P
Q
1.5 MIN
50 MIN
20.2 MIN
13±.2
40 MIN
R
S
T
U
V
QTY/REEL
2.5 MIN
10 MIN
22.4 MAX
360 MAX
16.4+2-0
1,000
REEL
A
B
C
D
E
F
16+.3-.1
7.5±.1
6.75±.1
4 ±.1
2±.1
F
G
H
J
K
L
8±.1
B0*
1.5 +.1-0
A0*
.3 ±.05
K0*
TAPE
Characteristic
Specification
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
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