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T Min
S
T Max
S
Critical Zone
T to T
L
P
Ramp-up
Ramp-down
T
L
T
P
t 25°C to Peak
t Preheat
S
t L
t
P
Temperature
(T)
Time (t)
Recommended Solder Reflow Methods
E2UFA12-16.384M TR
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
150°C
- Temperature Typical (TS TYP)
175°C
- Temperature Maximum (TS MAX)
200°C
- Time (tS MIN)
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
217°C
- Time (tL)
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target)
250°C +0/-5°C
Time within 5°C of actual peak (tp)
20 - 40 seconds
Ramp-down Rate
6°C/second Maximum
Time 25°C to Peak Temperature (t)
8 minutes Maximum
Moisture Sensitivity Level
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 8/12/2010 | Page 3 of 4