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參數(shù)資料
| 型號： | DSAU326 |
| 元件分類： | 電源模塊 |
| 英文描述： | DC-DC REG PWR SUPPLY MODULE |
| 封裝： | MODULE-12 |
| 文件頁數(shù)： | 4/8頁 |
| 文件大小： | 306K |
| 代理商： | DSAU326 |
4
Design & Feature Considerations
The DSAU300 circuit block diagrams are shown in
Figures 5 and 6.
Peak-to-Peak Output Noise Measurement
Scope measurement should be made by using a BNC
socket, measurement bandwidth is 0-20 MHz. Position
the load between 50 mm and 75 mm from the DC/DC
Converter. A Cout of 0.33uF ceramic capacitor is
placed between the terminals shown below.
+Out
-Out
+Vin
-Vin
Single Output
DC / DC
Converter
Resistive
Load
Scope
Copper Strip
Cout
+Out
-Out
+Vin
-Vin
Dual Output
DC / DC
Converter
Resistive
Load
Scope
Copper Strip
Cout
Com.
Scope
Cout
Input Source Impedance
The power module should be connected to a low ac-
impedance input source. Highly inductive source
impedances can affect the stability of the power
module.
+
+Out
-Out
+Vin
-Vin
DC / DC
Converter
Load
DC Power
Source
+
-
Cin
In applications where power is supplied over long lines
and output loading is high, it may be necessary to use
a capacitor at the input to ensure startup.
Capacitor mounted close to the input of the power
module helps ensure stability of the unit, it is
recommended to use a good quality low Equivalent
Series Resistance (ESR < 1.0
at 100 KHz) capacitor
of a 2.2uF for the 5V input devices, a 1.0uF for the 12V
and 15V input devices, and a 0.47uF for the 24V
devices.
Maximum Capacitive Load
The DSAU300 series has limitation of maximum connected
capacitance at the output. The power module may be
operated in current limiting mode during start-up, affecting
the ramp-up and the startup time.
Output Ripple Reduction
A good quality low ESR capacitor placed as close as
practicable across the load will give the best ripple and
noise performance.
To reduce output ripple, it is recommended to use 1.0uF
capacitors at the output.
+Out
-Out
+Vin
-Vin
Load
DC Power
Source
+
-
Cout
Single Output
DC / DC
Converter
+Out
-Out
+Vin
-Vin
Load
DC Power
Source
+
-
Cout
Com.
Dual Output
DC / DC
Converter
Soldering and Cleaning Considerations
Post solder cleaning is usually the final board assembly
process before the board or system undergoes electrical
testing. Inadequate cleaning and/or drying may lower the
reliability of a power module and severely affect the
finished circuit board assembly test. Adequate cleaning
and/or drying is especially important for un-encapsulated
and/or open frame type power modules. For assistance
on appropriate soldering and cleaning procedures,
please contact Delta’s technical support team.
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