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DS8005
Smart Card Interface
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3
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD = +3.3V, VDDA = +5.0V, TA = +25°C, unless otherwise noted. All specifications apply to the device, unless otherwise noted in
the CONDITIONS column.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CLOCK SOURCE
Crystal Frequency
fXTAL
External crystal (Note 1)
0
20
MHz
fXTAL1
(Note 1)
0
20
MHz
VIL_XTAL1
Low-level input on XTAL1
-0.3
0.3 x
VDD
XTAL1 Operating Conditions
VIH_XTAL1
High-level input on XTAL1
0.7 x
VDD
VDD +
0.3
V
External Capacitance for Crystal
CXTAL1,
CXTAL2
15
pF
Internal Oscillator
fINT
2.2
2.7
3.4
MHz
SHUTDOWN TEMPERATURE
Shutdown Temperature
TSD
+150
°C
RSTA AND RSTB PINS
Output Low Voltage
VOL_RST1
IOL_RST = 1mA
0.3
V
Card-Inactive Mode
Output Current
IOL_RST1
VOL_RST = 0V
-1
mA
Output Low Voltage
VOL_RST2
IOL_RST = 200μA
0.3
V
Output High
Voltage
VOH_RST2
IOH_RST = -200μA
VCC -
0.5
V
Rise Time
tR_RST
CL = 30pF (Note 1)
0.1
μs
Fall Time
tF_RST
CL = 30pF (Note 1)
0.1
μs
Current Limitation
IRST(LIMIT)
-20
+20
mA
Card-Active Mode
RSTIN to RST Delay
tD(RSTIN-RST)
2
μs
CLKA AND CLKB PINS
Output Low Voltage
VOL_CLK1
IOLCLK = 1mA
0.3
V
Card-Inactive Mode
Output Current
IOL_CLK1
VOLCLK = 0V
-1
mA
Output Low Voltage
VOL_CLK2
IOLCLK = 200μA
0.3
V
Output High
Voltage
VOH_CLK2
IOHCLK = -200μA
VCC -
0.5
V
Rise Time
tR_CLK
CL = 30pF (Notes 1, 4)
8
ns
Fall Time
tF_CLK
CL = 30pF (Notes 1, 4)
8
ns
Current Limitation
ICLK(LIMIT)
-75
+75
mA
Clock Frequency
fCLK
Operational
0
10
MHz
Duty Factor
CL = 30pF
45
55
%
Card-Active Mode
Slew Rate
SR
CL = 30pF (Note 1)
0.2
V/ns
VCCA AND VCCB PINS
Output Low Voltage
VCC1
ICC = 1mA
0.3
V
Card-Inactive Mode
Output Current
ICC1
VCC = 0V
0
-1
mA