Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 2 Maxim Integrated DS3231 ABS" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉(h脿o)锛� DS3231SN#T&R
寤犲晢锛� Maxim Integrated Products
鏂囦欢闋�(y猫)鏁�(sh霉)锛� 12/20闋�(y猫)
鏂囦欢澶у皬锛� 0K
鎻忚堪锛� IC RTC W/TCXO 16-SOIC
鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″锛� Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 1,000
椤炲瀷锛� 鏅�(sh铆)閻�/鏃ユ
鐗归粸(di菐n)锛� 璀﹀牨(b脿o)鍣�锛岄枏骞�锛屾柟娉㈣几鍑猴紝TCXO/鏅堕珨
鏅�(sh铆)闁撴牸寮忥細 HH:MM:SS锛�12/24 灏忔檪(sh铆)锛�
鏁�(sh霉)鎿�(j霉)鏍煎紡锛� YY-MM-DD-dd
鎺ュ彛锛� I²C锛�2 绶氫覆鍙�
闆绘簮闆诲锛� 2.3 V ~ 5.5 V
闆诲 - 闆绘簮锛岄浕姹狅細 2.3 V ~ 5.5 V
宸ヤ綔婧害锛� -40°C ~ 85°C
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
灏佽/澶栨锛� 16-SOIC锛�0.295"锛�7.50mm 瀵級
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 16-SOIC W
鍖呰锛� 甯跺嵎 (TR)
Extremely Accurate I2C-Integrated
RTC/TCXO/Crystal
2
Maxim Integrated
DS3231
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
(TA = TMIN to TMAX, unless otherwise noted.) (Notes 2, 3)
Stresses beyond those listed under 鈥淎bsolute Maximum Ratings鈥� may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on Any Pin Relative to Ground......-0.3V to +6.0V
Junction-to-Ambient Thermal Resistance (
JA) (Note 1)....73掳C/W
Junction-to-Case Thermal Resistance (
JC) (Note 1) ......23掳C/W
Operating Temperature Range
DS3231S ..............................................................0掳C to +70掳C
DS3231SN ........................................................-40掳C to +85掳C
Junction Temperature ......................................................+125掳C
Storage Temperature Range ...............................-40掳C to +85掳C
Lead Temperature (soldering, 10s) .................................+260掳C
Soldering Temperature (reflow, 2 times max)..................+260掳C
(See the
Handling, PC Board Layout, and Assembly section.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC
2.3
3.3
5.5
V
Supply Voltage
VBAT
2.3
3.0
5.5
V
Logic 1 Input SDA, SCL
VIH
0.7 x
VCC
VCC +
0.3
V
Logic 0 Input SDA, SCL
VIL
-0.3
0.3 x
VCC
V
ELECTRICAL CHARACTERISTICS
(VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC =
3.3V, VBAT = 3.0V, and TA = +25掳C, unless otherwise noted.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC = 3.63V
200
Active Supply Current
ICCA
(Notes 4, 5)
VCC = 5.5V
300
渭A
VCC = 3.63V
110
Standby Supply Current
ICCS
I2C bus inactive, 32kHz
output on, SQW output off
(Note 5)
VCC = 5.5V
170
渭A
VCC = 3.63V
575
Temperature Conversion Current
ICCSCONV
I2C bus inactive, 32kHz
output on, SQW output off
VCC = 5.5V
650
渭A
Power-Fail Voltage
VPF
2.45
2.575
2.70
V
Logic 0 Output, 32kHz,
INT/SQW, SDA
VOL
IOL = 3mA
0.4
V
Logic 0 Output,
RST
VOL
IOL = 1mA
0.4
V
Output Leakage Current 32kHz,
INT/SQW, SDA
ILO
Output high impedance
-1
0
+1
渭A
Input Leakage SCL
ILI
-1
+1
渭A
RST Pin I/O Leakage
IOL
RST high impedance (Note 6)
-200
+10
渭A
VBAT Leakage Current
(VCC Active)
IBATLKG
25
100
nA
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
DS3232MZ+ IC RTC W/SRAM I2C 8SOIC
DS3232SN#T&R IC RTC W/TCXO 20-SOIC
DS3234S# IC RTC W/TCXO 20-SOIC
DS32C35-33#T&R IC RTC ACCURATE I2C 3.3V 20-SOIC
DS3911T+ IC DAC 10BIT I2C QUAD 14TDFN
鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
DS3232 鍒堕€犲晢:鏈煡寤犲 鍒堕€犲晢鍏ㄧū:鏈煡寤犲 鍔熻兘鎻忚堪:Extremely Accurate I2C RTC with Integrated Crystal and SRAM
DS3232_07 鍒堕€犲晢:MAXIM 鍒堕€犲晢鍏ㄧū:Maxim Integrated Products 鍔熻兘鎻忚堪:Extremely Accurate I2C RTC with Integrated Crystal and SRAM
DS3232_08 鍒堕€犲晢:MAXIM 鍒堕€犲晢鍏ㄧū:Maxim Integrated Products 鍔熻兘鎻忚堪:Extremely Accurate I2C RTC with Integrated Crystal and SRAM
DS3232_10 鍒堕€犲晢:MAXIM 鍒堕€犲晢鍏ㄧū:Maxim Integrated Products 鍔熻兘鎻忚堪:Extremely Accurate I2C RTC with Integrated Crystal and SRAM
DS3232-3+ 鍔熻兘鎻忚堪:瀵�(sh铆)鏅�(sh铆)鏅�(sh铆)閻� RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅�(sh铆)闁撴牸寮�:HH:MM:SS RTC 瀛樺劜(ch菙)瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube