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參數(shù)資料
| 型號： | DS2045W-100 |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | DRAM |
| 英文描述： | 3.3V Single-Piece 1Mb Nonvolatile SRAM |
| 中文描述： | 128K X 8 NON-VOLATILE SRAM MODULE, 100 ns, PBGA256 |
| 封裝： | 27 X 27 MM, PLASTIC, MODULE, BGA-256 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 207K |
| 代理商： | DS2045W-100 |
D
Read Mode
The DS2045W executes a read cycle whenever
WE
(write
enable) is inactive (high) and
CE
(chip enable) is active
(low). The unique address specified by the 17 address
inputs (A0 to A16) defines which of the 131,072 bytes of
data is to be accessed. Valid data will be available to the
eight data output drivers within t
ACC
(access time) after
the last address input signal is stable, providing that
CE
and
OE
(output enable) access times are also satisfied. If
CE
and
OE
access times are not satisfied, then data
access must be measured from the later occurring signal
(
CE
or
OE
) and the limiting parameter is either t
CO
for
CE
or t
OE
for
OE
rather than address access.
Write Mode
The DS2045W executes a write cycle whenever the
CE
and
WE
signals are active (low) after address inputs
are stable. The later-occurring falling edge of
CE
or
WE
will determine the start of the write cycle. The write
cycle is terminated by the earlier rising edge of
CE
or
WE
. All address inputs must be kept valid throughout
the write cycle.
WE
must return to the high state for a
minimum recovery time (t
WR
) before another cycle can
be initiated. The
OE
control signal should be kept inac-
tive (high) during write cycles to avoid bus contention.
However, if the output drivers have been enabled (
CE
and
OE
active) then
WE
will disable the outputs in t
ODW
from its falling edge.
Data-Retention Mode
The DS2045W provides full functional capability for V
CC
greater than 3.0V and write-protects by 2.8V. Data is
maintained in the absence of V
CC
without additional
support circuitry. The NV static RAM constantly moni-
tors V
CC
. Should the supply voltage decay, the NV
SRAM automatically write-protects itself. All inputs
become “don’t care”, and all data outputs become high
impedance. As V
CC
falls below approximately 2.5V
(V
SW
), the power-switching circuit connects the lithium
energy source to the RAM to retain data. During power-
up, when V
CC
rises above V
SW
, the power-switching
circuit connects external V
CC
to the RAM and discon-
nects the lithium energy source. Normal RAM operation
can resume after V
CC
exceeds V
TP
for a minimum
duration of t
REC
.
Battery Charging
When V
CC
is greater than V
TP
, an internal regulator
charges the battery. The UL-approved charger circuit
includes short-circuit protection and a temperature-sta-
bilized voltage reference for on-demand charging of
the internal battery. Typical data-retention expectations
of 3 years
per charge cycle
are achievable.
A maximum of 96 hours of charging time is required to
fully charge a depleted battery.
System Power Monitoring
When the external V
CC
supply falls below the selected
out-of-tolerance trip point, the output
RST
is forced
active (low). Once active, the
RST
is held active until
the V
CC
supply has fallen below that of the internal bat-
tery. On power-up, the
RST
output is held active until
the external supply is greater than the selected trip
point and one reset timeout period (t
RPU
) has elapsed.
This is sufficiently longer than t
REC
to ensure that the
SRAM is ready for access by the microprocessor.
Freshness Seal and Shipping
The DS2045W is shipped from Dallas Semiconductor
with the lithium battery electrically disconnected, guar-
anteeing that no battery capacity has been consumed
during transit or storage. As shipped, the lithium battery
is ~60% charged, and no preassembly charging oper-
ations should be attempted.
When V
CC
is first applied at a level greater than V
TP
,
the lithium battery is enabled for backup operation. A
96 hour initial battery charge time is recommended for
new system installations.
DS2045W 3.3V Single-Piece 1Mb
Nonvolatile SRAM
10
____________________________________________________________________
Memory Operation Truth Table
X = Don’t care.
WE
1
1
0
X
CE
0
0
0
1
OE
0
1
X
X
MODE
Read
Read
Write
Standby
I
CC
Active
Active
Active
Standby
OUTPUTS
Active
High Impedance
High Impedance
High Impedance
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| DS2045W-100# | 功能描述:NVRAM RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)總線寬度:8 bit 存儲容量:1024 Kbit 組織:128 K x 8 接口類型:Parallel 訪問時(shí)間:70 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 工作電流:85 mA 最大工作溫度:+ 70 C 最小工作溫度:0 C 封裝 / 箱體:EDIP 封裝:Tube |
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| DS2045Y-100# | 功能描述:NVRAM RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)總線寬度:8 bit 存儲容量:1024 Kbit 組織:128 K x 8 接口類型:Parallel 訪問時(shí)間:70 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 工作電流:85 mA 最大工作溫度:+ 70 C 最小工作溫度:0 C 封裝 / 箱體:EDIP 封裝:Tube |
| DS2045Y20# | 制造商:Maxim Integrated Products 功能描述: |
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