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參數資料
| 型號： | DS1646P-120+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數： | 3/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC RAM TIMEKEEP NV 120NS 34-PCM |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 40 |
| 類型： | 時鐘/日歷 |
| 特點： | 閏年，NVSRAM |
| 存儲容量： | 128KB |
| 時間格式： | HH:MM:SS（24 小時） |
| 數據格式： | YY-MM-DD-dd |
| 接口： | 并聯(lián) |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 電壓 - 電源，電池： | 3V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 34-PowerCap? 模塊 |
| 供應商設備封裝： | 34-PowerCap 模塊 |
| 包裝： | 管件 |
| 產品目錄頁面： | 1432 (CN2011-ZH PDF) |
DS1646/DS1646P
11 of 12
NOTES:
1) All voltages are referenced to ground.
2) Typical values are at 25°C and nominal supplies.
3) Outputs are open.
4) Data retention time is at 25°C and is calculated from the date code on the device package. The date
code XXYY is the year followed by the week of the year in which the device was manufactured. For
example, 9225 would mean the 25th week of 1992.
5) tAH1, tDH1 are measured from WE going high.
6) tAH2, tDH2 are measured from CE going high.
7) Real-Time Clock Modules (EDIP) can be successfully processed through conventional wave-
soldering techniques as long as temperatures as long as temperature exposure to the lithium energy
source contained within does not exceed +85°C. Post-solder cleaning with water washing techniques
is acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“l(fā)ive-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND
PATTERN NO.
32 EDIP
MDF32+1
—
34 PCAP
PC2+6
—
相關PDF資料 |
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|---|---|
| DS1744W-120IND+ | IC RTC RAM Y2K 3.3V 120NS 28EDIP |
| AD5273BRJZ50-REEL7 | IC POT DGTL 50K 64POS SOT23 |
| DS1744-70IND+ | IC RTC RAM Y2K 5V 70NS 28-EDIP |
| DS1644P-120+ | IC RAM TIMEKEEP NV 120NS 34-PCM |
| VI-JTJ-MZ | CONVERTER MOD DC/DC 36V 25W |
相關代理商/技術參數 |
參數描述 |
|---|---|
| DS1646P-120+ | 功能描述:實時時鐘 NV Timekeeping RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1647 | 制造商:DALLAS 制造商全稱:Dallas Semiconductor 功能描述:Nonvolatile Timekeeping RAM |
| DS1647-12 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:NVRAM (Battery Based) |
| DS1647-120 | 功能描述:實時時鐘 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1647-120+ | 功能描述:實時時鐘 NV Timekeeping RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
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