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參數(shù)資料
| 型號(hào)： | DS1643-100 |
| 廠(chǎng)商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 4/17頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC RAM TIMEKEEP NV 100NS 28-EDIP |
| 標(biāo)準(zhǔn)包裝： | 12 |
| 類(lèi)型： | 時(shí)鐘/日歷 |
| 特點(diǎn)： | 閏年，NVSRAM |
| 存儲(chǔ)容量： | 8KB |
| 時(shí)間格式： | HH:MM:SS（24 小時(shí)） |
| 數(shù)據(jù)格式： | YY-MM-DD-dd |
| 接口： | 并聯(lián) |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類(lèi)型： | 通孔 |
| 封裝/外殼： | 28-DIP 模塊（0.600"，15.24mm） |
| 供應(yīng)商設(shè)備封裝： | 28-EDIP |
| 包裝： | 管件 |
| 其它名稱(chēng)： | DS1643100 |
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DS1643/DS1643P
12 of 17
AC TEST CONDITIONS
Output Load: 100pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25
C and nominal supplies.
3) Outputs are open.
4) The CE2 control signal functions exactly the same as the CE signal except that the logic levels for
active and inactive levels are opposite.
5) Data retention time is at 25
C.
6) Each DS1643 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules as a cumulative time in the absence of VCC starting
from the time power is first applied by the user.
7) Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85
C. Post-solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“l(fā)ive-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To
remove the part, apply flux, heat the lead frame pad until the solder reflow and use a solder
wick to remove solder.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
28 EDIP
MDF28+2
34 PowerCap
PC1+2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS1643-100+ | 功能描述:實(shí)時(shí)時(shí)鐘 NV Timekeeping RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線(xiàn)接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1643-12 | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:Real-Time Clock |
| DS1643-120 | 制造商:DALLAS 制造商全稱(chēng):Dallas Semiconductor 功能描述:Nonvolatile Timekeeping RAM |
| DS1643-15 | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:Real-Time Clock |
| DS1643-150 | 制造商:DALLAS 制造商全稱(chēng):Dallas Semiconductor 功能描述:Nonvolatile Timekeeping RAM |
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