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參數(shù)資料
| 型號： | DS1556-70 |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | Timer or RTC |
| 英文描述： | REAL TIME CLOCK, PDMA32 |
| 封裝： | EDIP MODULE-32 |
| 文件頁數(shù)： | 9/23頁 |
| 文件大?。?/td> | 443K |
| 代理商： | DS1556-70 |
DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
17 of 21
AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels:
0.0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1. Voltage referenced to ground.
2. Typical values are at +25
°C and nominal supplies.
3. Outputs are open.
4. Battery switchover occurs at the lower of either the battery voltage or VPF.
5. The
IRQ/FT and RST outputs are open drain.
6. Data-retention time is at +25
°C.
7. Each DS1556 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules and PowerCap modules as a cumulative time in the
absence of VCC starting from the time power is first applied by the user.
8. RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
as long as temperature exposure to the lithium energy source contained within does not exceed
+85
°C. Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic
vibration is not used.
In addition, for the PowerCap:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“l(fā)ive-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
9. tAH1, tDH1 are measured from WE going high.
10. tAH2, tDH2 are measured from CE going high.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DS1556W-120 | REAL TIME CLOCK, DMA32 |
| DS1556 | REAL TIME CLOCK, DMA32 |
| DS1556P | REAL TIME CLOCK, DMA34 |
| DS1557WP-120 | 0 TIMER(S), REAL TIME CLOCK, DMA34 |
| DS1557P-70 | 0 TIMER(S), REAL TIME CLOCK, DMA34 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS1556-70+ | 功能描述:實時時鐘 1M NV RAM Timekeeper RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1556-70IND | 功能描述:實時時鐘 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1556-70IND+ | 功能描述:實時時鐘 1M NV RAM Timekeeper RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1556-70-W | 功能描述:實時時鐘 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1556P | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1MEG NV Y2KC Real Time Clocks RAM |
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