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參數資料
| 型號： | DS1554-70IND |
| 廠商： | Maxim Integrated Products |
| 文件頁數： | 9/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC RTC RAM Y2K 5V 70NS 32-EDIP |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 11 |
| 類型： | 時鐘/日歷 |
| 特點： | 警報器，閏年，NVSRAM，監(jiān)視計時器，Y2K |
| 存儲容量： | 32KB |
| 時間格式： | HH:MM:SS（24 小時） |
| 數據格式： | YY-MM-DD-dd |
| 接口： | 并聯 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 32-DIP 模塊（0.600"，15.24mm） |
| 供應商設備封裝： | 32-EDIP |
| 包裝： | 管件 |
DS1554 256k, Nonvolatile, Y2K-Compliant Timekeeping RAM
17 of 18
AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1) Voltage referenced to ground.
2) Typical values are at +25
C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery voltage or VPF.
5) The IRQ /FT and
RST outputs are open drain.
6) Data-retention time is at +25
C.
7) Each DS1554 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules and PowerCap modules as a cumulative time in the
absence of VCC starting from the time power is first applied by the user.
8) RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
as long as temperature exposure to the lithium energy source contained within does not exceed
+85
C. Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic
vibration is not used.
In addition, for the PowerCap:
a. Maxim recommends that PowerCap Module bases experience one pass through solder reflow
oriented with the label side up (“l(fā)ive-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
9) tAH1, tDH1 are measured from WE going high.
10) tAH2, tDH2 are measured from CE going high.
11) tWC = 200ns.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-”
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
LAND PATTERN NO.
32 EDIP
MDF32+1
—
34 PWRCP
PC2+2
—
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相關代理商/技術參數 |
參數描述 |
|---|---|
| DS1554-70IND+ | 功能描述:實時時鐘 256kB NV RAM Timekeeper RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1554P | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Real-Time Clock |
| DS1554P/YP/WP | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:PowerCap with Crystal |
| DS1554P-100 | 制造商:DALLAS 制造商全稱:Dallas Semiconductor 功能描述:256K NV Y2KC Timekeeping RAM |
| DS1554P-70 | 功能描述:實時時鐘 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
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