參數(shù)資料
型號: DS1330W
英文描述: 3.3V 256K Nonvolatile SRAM with Battery Monitor
中文描述: 3.3V、256k非易失SRAM,帶有電池監(jiān)測器
文件頁數(shù): 10/11頁
文件大小: 107K
代理商: DS1330W
DS1330W
022598 10/11
DS1330W NONVOLATILE SRAM, 34–PIN POWERCAP MODULE WITH POWERCAP
PKG
DIM
INCHES
MIN
NOM
MAX
A
0.920
0.925
0.930
B
0.955
0.960
0.965
C
0.240
0.245
0.250
D
0.052
0.055
0.058
E
0.048
0.050
0.052
F
0.015
0.020
0.025
G
0.020
0.025
0.030
TOP VIEW
SIDE VIEW
BOTTOM VIEW: REFERENCE ONLY
COMPONENTS AND PLACEMENTS
MAY DIFFER FROM THOSE SHOWN
ASSEMBLY AND USE
Reflow soldering
Dallas Semiconductor recommends that
PowerCap Module bases experience
one pass through solder reflow oriented
label–side up (live–bug).
Hand soldering and touch–up
Do not touch soldering iron to leads for
more than 3 seconds. To solder, apply
flux to the pad, heat the lead frame pad
and apply solder. To remove part, apply
flux, heat pad until solder reflows, and
use a solder wick.
LPM replacement in a socket
To replace a Low Profile Module in a
68–pin
PLCC
socket,
DS9034PC PowerCap to a module base
then insert the complete module into the
socket one row of leads at a time, push-
ing only on the corners of the cap. Never
apply force to the center of the device.
To remove from a socket, use a PLCC
extraction tool and ensure that it does
not hit or damage any of the module IC
components. Do not use any other tool
for extraction.
attach
a
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