參數(shù)資料
型號(hào): DS12C887
英文描述: Real Time Clock
中文描述: 實(shí)時(shí)時(shí)鐘
文件頁(yè)數(shù): 14/19頁(yè)
文件大?。?/td> 193K
代理商: DS12C887
DS12C887
14 of 19
AC ELECTRICAL CHARACTERISTICS
PARAMETER
Cycle Time
Pulse Width, DS/E Low or
RD/
WR
High
Pulse Width, DS/E High or
RD/
WR
Low
Input Rise and Fall
R/
W
Hold Time
(0°C to 70°C; VCC = 5.0V ± 10%)
TYP
MAX
DC
SYMBOL
t
CYC
PW
EL
MIN
385
150
UNITS
ns
ns
NOTES
PW
RH
125
ns
t
R
, t
F
t
RWH
t
RWS
t
CS
30
ns
ns
10
R/
W
Setup Time Before DS/E
Chip Select Setup Time Before
DS,
WR
, or
RD
Chip Select Hold Time
Read Data Hold Time
Write Data Hold Time
Mux’ed Address Valid Time to
ALE Fall
Mused Address Hold Time to
ALE Fall
Delay Time DS/E to AS/ALE
Rise
Pulse Width AS/ALE High
Delay Time, AS/ALE to DS/E
Rise
Output Data Delay Time from
DS/E or
RD
Data Setup Time
Reset Pulse Width
50
ns
20
ns
t
CH
t
DHR
t
DHW
t
ASL
0
10
0
30
ns
ns
ns
ns
80
t
AHL
10
ns
t
ASD
20
ns
PW
ASH
t
ASED
60
40
ns
ns
t
DDR
20
120
ns
6
t
DSW
t
RWL
t
IRDS
100
5
ns
μ
s
μ
s
μ
s
IRQ
Release from DS
2
IRQ
Release from
RESET
t
IRR
2
NOTES:
1.
All voltages are referenced to ground.
2.
All Outputs are open.
3.
The MOT pin has an internal pull-down of 20K
.
4.
Applies to the AD0-AD7 pins, the
IRQ
pin, and the SQW pin when each is in a high impedance state.
5.
The
IRQ
pin is open drain.
6.
Measured with a load as shown in Figure 4.
7.
Real-Time Clock Modules can be successfully processed through conventional wave-soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85°C. Post solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used. Such cleaning can damage the crystal.
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