參數(shù)資料
型號: DS1248Y-70+
廠商: Maxim Integrated Products
文件頁數(shù): 9/19頁
文件大?。?/td> 0K
描述: IC NVSRAM 1MBIT 70NS 32DIP
產(chǎn)品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 11
類型: Phantom 計時芯片
特點: NVSRAM
存儲容量: 128KB
時間格式: HH:MM:SS:hh(12/24 小時)
數(shù)據(jù)格式: YY-MM-DD-dd
接口: 并聯(lián)
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 32-DIP 模塊(0.600",15.24mm)
供應商設備封裝: 32-EDIP
包裝: 管件
產(chǎn)品目錄頁面: 1432 (CN2011-ZH PDF)
DS1248/DS1248P 1024K NV SRAM with Phantom Clock
17 of 19
AC TEST CONDITIONS
Output Load: 50pF + 1TTL Gate
Input Pulse Levels: 0 to 3V
Timing Measurement Reference Levels
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) WE is high for a read cycle.
2) OE = VIH or VIL. If CE = VIH during write cycle, the output buffers remain in a high impedance state.
3) tWP is specified as the logical AND of CE and WE. tWP is measured from the latter of CE or WE going
low to the earlier of CE or WE going high.
4) tDH, tDS are measured from the earlier of CE or WE going high.
5) These parameters are sampled with a 50pF load and are not 100% tested.
6) If the CE low transition occurs simultaneously with or later than the WE low transition in Write Cycle
1, the output buffers remain in a high-impedance state during this period.
7) If the CE high transition occurs prior to or simultaneously with the WE high transition, the output
buffers remain in a high-impedance state during this period.
8) If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,
the output buffers remain in a high impedance state during this period.
9) The expected tDR is defined as cumulative time in the absence of VCC with the clock oscillator
running.
10) tWR is a function of the latter occurring edge of WE or CE.
11) Voltages are referenced to ground.
12) RST (Pin 1) has an internal pullup resistor.
13) RTC modules can be successfully processed through conventional wave-soldering techniques as long
as temperature exposure to the lithium energy source contained within does not exceed +85°C. Post-
solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibration is not
used. See the PowerCap package drawing for details regarding the PowerCap package.
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