參數(shù)資料
型號: DRV591VFP(1)
廠商: Texas Instruments, Inc.
元件分類: 繼電器,輸入/輸出模塊
英文描述: 30 AMP MINIATURE POWER RELAY
中文描述: 3 -一種高效的PWM功率驅(qū)動器
文件頁數(shù): 2/16頁
文件大?。?/td> 141K
代理商: DRV591VFP(1)
SLOS389A
NOVEMBER 2001
REVISED MAY 2002
www.ti.com
2
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
ORDERING INFORMATION
TA
PowerPAD QUAD FLATPACK
(VFP)
DRV591VFP(1)
40
°
C to 85
°
C
(1)This package is available taped and reeled. To order this
packaging option, add an R suffix to the part number (e.g.,
DRV591VFPR).
DRV591
UNIT
Supply voltage, AVDD, PVDD
0.3 to 5.5
V
Input voltage, VI
Output current, IO (FAULT0, FAULT1)
Continuous total power dissipation
0.3 to VDD + 0.3
1
V
mA
See Dissipation Rating Table
Operating free-air temperature range, TA
Operating junction temperature range, TJ
Storage temperature range, Tstg
(1)Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
recommended operating conditions
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
40 to 85
°
C
°
C
°
C
40 to 150
65 to 165
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
5.5
UNIT
Low-level input voltage, VIL
0.8
85
°
C
Operating free-air temperature, TA
FREQ, INT/EXT, SHUTDOWN, COSC
FREQ, INT/EXT, SHUTDOWN, COSC
40
2
V
V
PACKAGE DISSIPATION RATINGS
Θ
JA
(1)
(
°
C/W)
VFP
29.4
(1)This data was taken using 2 oz trace and copper pad that is
soldered directly to a JEDEC standard 4-layer 3 in
×
3 in PCB.
PACKAGE
Θ
JC
(
°
C/W)
1.2
TA = 25
°
C
POWER RATING
4.1 W
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