
16 Megabit High Speed CMOS SRAM
DPS1MX16MKn3
DESCRIPTION:
The DPS1MX16MKn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages.  The module packs 16-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in
2
, while maintaining a
total height as low as 0.269 inches.
The DPS1MX16MKn3 STACK modules contain four individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and
military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
FEATURES:
 Organizations Available:
  1Meg x 16 or 2 Meg x 8
 Access Times:   20*, 25, 30, 35, 45ns
 Fully Static Operation
 - No clock or refresh required
 Single +5V Power Supply, 
±
10% Tolerance
 TTL Compatible
 Common Data Inputs and Outputs 
 Low Data Retention Voltage:  2.0V min. 
 Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
*
 Commercial and Industrial Grade only.
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
 Address Inputs
 Data Input/Output
 Low Chip Enables
 Write Enable
 Output Enables
 Power (+5V)
 Ground
 No Connect
 A0 - A18
 I/O0 - I/O15
 CE0 - CE3
 WE
 OE0, OE1
 V
DD
 V
SS
 N.C.
Gullwing
Leaded 
Stack
‘’J’’ Leaded 
Stack
SLCC Stack
Straight 
Leaded
Stack
This document contains information on a product that is currently released
30A129-04
REV. E
1
  This Material Copyrighted By Its Respective Manufacturer