參數(shù)資料
型號(hào)： DPAF-06-03.0-H-3-2-A
廠(chǎng)商： SAMTEC INC
元件分類(lèi)： 電路板相疊連接器
英文描述： 18 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
封裝： ROHS COMPLIANT
文件頁(yè)數(shù)： 1/1頁(yè)
文件大?。?/td> 505K
代理商： DPAF-06-03.0-H-3-2-A
(2,16mm) .085"
DPAM, DPAF SERIES
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAF–23–03.0–H–8–2–A
DPAM–23–07.0–H–8–2–A
WWW.SAMTEC.COM
DPAM Mates with:
DPAF, RDPAF
DPAF Mates with:
DPAM
For complete specifications and
recommended PCB layouts see
www.samtec.comDPAM or
www.samtec.comDPAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au over 50μ" (1,27μm) Ni
Current Rating (2x3):
2.9A @ 30°C Temperature Rise
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10.4m
Ω
max
Working Voltage:
300 VAC
Mated Cycles:
100 Cycles
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
ALSO
AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
F-211
SPECIFICATIONS
Note:
Other Gold plating
options available.
Contact Samtec.
PAIRS
PER ROW
OPTION
DPAM
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
LEAD
STYLE
A
–04, –06
(–07.0 only)
–08, –15, –23
(All lead styles)
–8
=Eight
Pair
Rows
–3
=Three
Pair
Rows
(–07 only)
–2
= Lead-Free
Tin Alloy
96.5% Sn/
3% Ag/.5% Cu
Solder Crimp
Specify
LEAD
STYLE
from
chart
–S
=30μ" (0,76μm)
Gold on contact area,
Tin on solder tail
(–11 & –14 only)
–H
=30μ" (0,76μm)
Gold on contact area,
Gold Flash
on solder tail
(–07 only)
–K
=(20,00mm) 0.80"
DIA Polyimide
film Pick &
Place Pad
–TR
=Tape & Reel
–GP
=Guide Post
(–23 only &
–07 only)
No. of positions x (2,16) .085 + (4,34) .171
(2,16) .085
(.050
DIA
(1,08) .0425
(.100
(2,54)
.100
No. of positions x (2,16) .085 + (2,95) .116
A
B
G1
02 01 G2 03 04
(.005
Perimeter
Signal Pairs (TYP)
(.050
A
LEAD
STYLE
–07.0
–11.0
–14.0
(6,66) .262
(10,72) .422
(13,66) .538
B
NO OF
ROWS
–8
–3
(24,59) .968
(11,89) .468
A
NO OF
ROWS
(23,32)
.918
(10,62)
.418
–8
–3
Fibre Channel
Rapid I/O
PCI Express
SATA
Infiniband
XAUI
MGT (Rocket I/O)
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
Protocols
Supported
USABLE PAIRS
PER ARRAY*
48 Pairs
SIZE
104 Pairs
168 Pairs
18 Pairs
39 Pairs
63 Pairs
–08 x –8
–15 x –8
–23 x –8
–08 x –3
–15 x –3
–23 x –3
each row are grounded
PAIRS
PER ROW
OPTION
DPAF
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
–04, –06, –08,
–15, –23
–8
=Eight
Pair Rows
–3
=Three
Pair Rows
–H
=30μ" (0,76μm)
Gold on contact area,
Gold Flash on solder tail
–K
=(20,00mm)
0.80" DIA
Polyimide
film
Pick &
Place Pad
–TR
=Tape
& Reel
–2
= Lead-Free Tin Alloy
96.5% Sn/ 3%Ag/
.5% Cu
Solder Crimp
03.0
f
i
n
a
l
i
n
c
h
.
c
o
m
(.254
(.060
A
G2
03
01
02
G1
04
(1,27) .050
No. of positions x (2,16) .085 + (4,34) .171
Perimeter Grounds (TYP)
Solder crimped on tail
(.100
Pairs
(TYP)
(2,16) .085
(1,08) .0425
No. of positions x (2,16) .085 + (2,95) .116
(.050
DIA
(.005
(.050
Staggered pitch DPAM/DPAF
10mm Stack Height
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.comDPAM,
www.samtec.comDPAF or contact sig@samtec.com
Rated @ 3dB Insertion Loss
7.0 GHz / 14.0 Gbps
DPAM
LEAD
STYLE
–07.0
–11.0
–14.0
*Processing conditions will
affect mated height.
DPAF
MATED HEIGHT*
–03.0
10mm
14mm
17mm
相關(guān)PDF資料
PDF描述
DPAF-06-03.0-H-8-2-A 48 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
DPAM-04-07.0-H-3-2-A 12 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
DPAM-04-07.0-H-8-2-A 32 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
DPAM-06-07.0-H-3-2-A 18 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
DPAM-06-07.0-H-8-2-A 48 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DPAF-08-03.0-H-3 制造商:Samtec Inc 功能描述:CONN DP ARY SKT 24 POS 2.16MM SLDR ST SMD - Bulk
DPAF-08-03.0-H-3-1 制造商:Samtec Inc 功能描述:CONN DP ARY SKT 24 POS 2.16MM SLDR ST SMD - Bulk
DPAF-08-03.0-H-3-2 制造商:Samtec Inc 功能描述:DPAF - Bulk
DPAF-08-03.0-H-3-2-A 功能描述:CONN ARRAY DIFF FEMALE 3X8PAIR RoHS:是 類(lèi)別:連接器，互連式 >> 板對(duì)板 - 陣列，邊緣類(lèi)型，包廂 系列:DP Array® DPAF 標(biāo)準(zhǔn)包裝:3,000 系列:SlimStack™ 502396 連接器類(lèi)型:插頭，外罩觸點(diǎn) 位置數(shù):100 間距:0.016"（0.40mm） 行數(shù):2 安裝類(lèi)型:表面貼裝 特點(diǎn):固定焊尾 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:8µin（0.20µm） 包裝:帶卷 (TR) 配接層疊高度:2.5mm 板上方高度:0.084"（2.13mm） 其它名稱(chēng):502396-1010
DPAF-08-03.0-H-3-2-A-K 制造商:Samtec Inc 功能描述:CONN DP ARY SKT 24 POS 2.16MM SLDR ST SMD - Bulk
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