參數(shù)資料
型號(hào): DM3A-SF-PEJ2
元件分類: PCB用連接器
英文描述: PCB CONNECTOR
封裝: ROHS COMPLIANT
文件頁(yè)數(shù): 5/7頁(yè)
文件大小: 823K
代理商: DM3A-SF-PEJ2
5
I
Packaging Specifications
Preheating
Time (Seconds)
90 sec. to 120 sec.
150
200
230 min
250 max
Soldering
50 sec.
250
()
200
150
100
50
T
I
Recommended Temperature Profile
(3.2)
3
2
2
1
.
20±0.1
1
(
P=4±0.1
Unreeling direction
G
Embossed carrier tape dimensions
1,500pieces per reel
Top cover tape
Embossed carrier tape
End section
Mounting section
Lead section (400mm min.)
Blank section (100mm min.)
Blank section
(160mm min.)
32.4
G
Reel dimensions
<Recommended conditions >
Reflow system
Environment
Solder composition
(M705-GRN360-K2-V manufactured by Senju Metal Industry Co., Ltd.)
Test board
: Glass epoxy 60mm x 100mm x 1mm thick
Metal mask thickness : 0.12 mm
: IR/Hot air reflow
: Room air
: Paste, 96.5%Sn / 3.0%Ag / 0.5%Cu
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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