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| 型號(hào)： | DG413DY-T |
| 廠商： | Intersil |
| 文件頁(yè)數(shù)： | 5/13頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH QUAD SPST 16SOIC |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | 開(kāi)關(guān) |
| 電路： | 4 x SPST - NC/NO |
| 導(dǎo)通狀態(tài)電阻： | 80 歐姆 |
| 電壓電源： | 單/雙電源 |
| 電壓 - 電源，單路/雙路(±)： | 5 V ~ 44 V，±5 V ~ 20 V |
| 電流 - 電源： | 100pA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-SOIC |
| 包裝： | 帶卷 (TR) |
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All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN3282.13
June 20, 2007
DG411, DG412, DG413
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N16
16
7
α
0°
8°
0°
8°
-
Rev. 1 6/05
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| DG413DYT1 | 制造商:Vishay Intertechnologies 功能描述: |
| DG413DY-T1 | 功能描述:模擬開(kāi)關(guān) IC Quad Mono SPST RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| DG413DY-T1-E3 | 功能描述:模擬開(kāi)關(guān) IC Quad SPST 22/25V RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| DG413DY-TRMEI | 制造商:Vishay Siliconix 功能描述:TAPE/REEL FOR MARQUETTE - Tape and Reel |
| DG413DYZ | 功能描述:模擬開(kāi)關(guān) IC SWITCH 4X SPST MIX 1 6NSOIC IND RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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