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參數(shù)資料
| 型號： | DG3003DB-T1-E1 |
| 廠商： | Vishay Siliconix |
| 文件頁數(shù)： | 12/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH SPST 6-MICRO FOOT |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 功能： | 開關(guān) |
| 電路： | 1 x SPDT - NC/NO |
| 導(dǎo)通狀態(tài)電阻： | 700 毫歐 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V |
| 電流 - 電源： | 100nA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-WFBGA |
| 供應(yīng)商設(shè)備封裝： | 6-Micro Foot? |
| 包裝： | 帶卷 (TR) |
www.vishay.com
8
Document Number: 72505
S11-0303-Rev. D, 28-Feb-11
Vishay Siliconix
DG3001, DG3002, DG3003
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH, 165 m BUMP HEIGHT)
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
Notes:
a. Use millimeters as the primary measurement.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72505.
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3003
Recommended Land Pattern
0.5
6 x 0.150
0.229
Note b
Solder Mask
Pad Dia. + 0.1
Silicon
Bump
Note a
b Diameter
32
1
A
B
e
D
e
A
A2
A1
S
E
EUTECTIC (Sn/Pb)
Dim.
Millimetersa
Inches
Min.
Max.
Min.
Max.
A
0.610
0.685
0.0240
0.0270
A1
0.140
0.190
0.0055
0.0075
A2
0.470
0.495
0.0185
0.0195
b
0.180
0.250
0.0071
0.0098
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0101
LEAD (Pb)-FREE (Sn/Ag/Cu)
Dim.
Millimetersa
Inches
Min.
Max.
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0102
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DG3003-T1 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:MICRO FOOT 3x2: 0.5-mm PITCH, 0.165-mm BUMP HEIGHT |
| DG300A | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:TTL-Compatible, CMOS Analog Switches |
| DG300A WAF | 制造商:Harris Corporation 功能描述: |
| DG300A/BCA | 制造商:Rochester Electronics LLC 功能描述: |
| DG300A/BIA | 制造商:Rochester Electronics LLC 功能描述: |
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