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參數(shù)資料
| 型號： | DF30CJ-22DS |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors |
| 中文描述： | 0.4 mm間距，0.9毫米高，板對板/板對FPC連接器 |
| 文件頁數(shù)： | 9/11頁 |
| 文件大小： | 865K |
| 代理商： | DF30CJ-22DS |
9
B
Usage Recommendations
2. Recommended manual soldering
3. Recommended screen thickness and
open area ratio (Pattern area ratio)
4.Board warpage
5.Cleaning conditions
6. Precautions
1. Recommended temperature profile
I
Due to the extremely small size of the connectors, handling it with bare hands should
be avoided. Follow the recommendations given on the proceeding pages.
I
Use of fluxes is NOT recommended.
I
Different production lots may exhibit some discoloration of the insulator material. This
will not affect form, fit or function of the connectors.
I
The connectors should not be used a sole PCB support. It is recommended to use
additional means of board support.
Refer to "Nylon Connector Use Handbook".
Maximum of 0.02 mm at the connector center, with both ends of the connector as reference points.
Manual soldering: 290
±
10
for 3 seconds
Thickness: 0.12 mm
Opening are ratio: DS side 100%, DP side 84%
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is
a return to normal temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the
connector terminals.
(Temperature)
Reflow Conditions
Preheating: 150 to 170 60 to 120 sec.
Soldering: 245±5
220
10 sec. max.
60 sec. max.
250 max.
220
200
250
150
100
60 to 120 sec.
60 sec. max.
50
0
0 sec.
50 sec.
100 sec.
150 sec. (Time)
10 sec. max
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DF30CJ-xxx | 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors |
| DF30FB-20DP-0.4V | 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors |
| DF30FB-20DS-0.4V | 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors |
| DF30FB-22DP-0.4V | 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors |
| DF30FB-22DS-0.4V | 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DF30CJ-22DS-0.4V(82) | 功能描述:板對板與夾層連接器 22P DBL ROW RECEPT CONDCT TEST STRT SMT RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| DF30CJ-24DP-0.4V(82) | 功能描述:板對板與夾層連接器 24P DBL ROW HDR CONDCT TEST STRT SMT RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| DF30CJ-24DS-0.4V(82) | 功能描述:板對板與夾層連接器 24P DBL ROW RECEPT CONDCT TEST STRT SMT RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| DF30CJ-30DP-0.4V(82) | 功能描述:板對板與夾層連接器 30P DBL ROW HDR CONDCT TEST STRT SMT RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| DF30CJ-30DS-0.4V(82) | 功能描述:板對板與夾層連接器 30P DBL ROW RECEPT CONDCT TEST STRT SMT RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
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