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參數(shù)資料
| 型號： | DF3-5S-2R28 |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 1KB RAM, 12-Bit ADC, USCI, HW Multiplier 64-LQFP -40 to 105 |
| 中文描述： | 2毫米間距連接器的離散線連接（產(chǎn)品通過UL CSA標準批準） |
| 文件頁數(shù)： | 2/12頁 |
| 文件大?。?/td> | 417K |
| 代理商： | DF3-5S-2R28 |
A265
1.
Recommended Temperature Profile (SMT)
2.
Recommended Manual Soldering Condition (SMT)
3.
Recommended Screen Thickness (SMT)
4. Board Warpage
(
SMT
)
5.
Recommended Soldering Condition
(
DIP
)
6. Cleaning Condition
7. Connection Condition
Note1: Maximum twice action is allowed under the same condition. However, the interval between
the first and second actions must be maintained at room temperature.
Note2: The temperature indicates the board surface temperature on the connector lead area.
Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
0.15
to
0.2mm
Based on both connector edges, 0.03mm max. in the connector center portion
I
Flow Condition with Automatic Soldering Tool. Soldering temperature: 250
±
5
, Soldering time: Within 3 seconds
I
Manual Soldering Condition. Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
Refer to the "Nylon Connector Use Hand book".
Refer to the "Nylon Connector Use Hand book".
B
Precautions
B
Embossed Carrier Tape Dimensions
Unit: mm
Product Type
Size
Number of Contacts
A
B
C
D
DF3/3D-
*
P-2H
2
to
4
5
to
7
8
to
12
13
to
15
24
32
44
56
–––
28.4
40.4
52.4
11.5
14.2
20.2
26.2
24.4
32.4
44.4
56.4
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| DF3-5S-2V | 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 1KB RAM, 12-Bit ADC, USCI, HW Multiplier 64-VQFN -40 to 105 |
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| DF3-6P-2C | 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 1024B RAM, Comparator 40-VQFN -40 to 85 |
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| DF3-6P-2DSA | 16-bit Ultra-Low-Power Microcontroller, 8KB Flash, 1024B RAM, Comparator 40-VQFN -40 to 105 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DF3-5S-2R28(05) | 功能描述:集管和線殼 2MM IDC RECPTACLE 5P 28AWG TIN RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector |
| DF3-5S-2V | 制造商:HRS 制造商全稱:HRS 功能描述:2mm Pitch Connector for Discrete Wire Connection(Product approved by UL CSA Standard) |
| DF-36 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog Miscellaneous |
| DF36012FPV | 功能描述:IC H8 MCU FLASH 16K 64LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 微型 標準包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲器容量:40KB（20K x 16） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| DF36012FPWV | 功能描述:MCU 3/5V 16K I TEMP PBFREE 64QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 微型 產(chǎn)品培訓模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
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